Microstructure and Mechanical Property of (Sn-9Zn0.05Ce)xBi Solder

被引：1
|
作者：
Du, Changhua [1 ]
Luo, Yi [1 ]
Su, Jian [1 ]
Yin, Limeng [2 ]
Li, Zhenkang [1 ]
Liu, Bin [1 ]
机构：
[1] Chongqing Univ Technol, Sch Mat Sci & Engn, Chongqing 400050, Peoples R China
[2] Chongqing Univ Sci & Technol, Sch Met & Mat Engn, Chongqing 401331, Peoples R China
来源：
MANUFACTURING PROCESS TECHNOLOGY, PTS 1-5 | 2011年 / 189-193卷
关键词：
(Sn-9Zn0.05Ce)xBi Solder; Microstructure; Tensile Strength; Hardness; LEAD-FREE SOLDER; ALLOYS;
D O I：
10.4028/www.scientific.net/AMR.189-193.3326
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The (Sn-9Zn0.05Ce)xBi solders with different Bi contents were prepared by a new process. The characteristics of solders about microstructure, tensile strength, elongation and microhardness were studied. The results showed that addition Bi can induce acicular or granular Zn-rich precipitated phase in Sn-9Zn0.05Ce solder. To increasing Bi content caused more Zn-rich phase distributed disorderly. When the Bi content was added to 4%, the granular Bi precipitated phase was observable. The tensile strength and hardness of (Sn-9Zn0.05Ce)xBi solder will raise, but elongation descend significantly due to the Bi content increasing. It can be funded that there was a more obvious turning point as w(Bi)=2wt %.
引用
收藏
页码：3326 / +
页数：2
相关论文
共 50 条
  • [21] Effects of Bismuth on the Microstructure, Properties, and Interfacial Reaction Layers of Sn-9Zn-xBi Solders
    Peng, Yan Zhi
    Li, Cai Ju
    Yang, Jiao Jiao
    Zhang, Jia Tao
    Peng, Ju Bo
    Zhou, Guang Ji
    Pu, Cun Ji
    Yi, Jian Hong
    METALS, 2021, 11 (04)
  • [22] Investigations of Sn-9Zn-Ag-Ga-Al-Ce Solder Wetted on Cu, Au/Ni/Cu, and Sn-plated Cu Substrates
    Wang, H.
    Xue, S.
    Chen, W.
    Liu, X.
    Pan, J.
    WELDING JOURNAL, 2010, 89 (12) : 249S - 255S
  • [23] THE MICROSTRUCTURE AND MECHANICAL PROPERTIES OF AS-CAST Sn-Sb-Zn LEAD FREE SOLDER ALLOYS
    Mladenovic, Srba
    Markovic, Desimir
    Ivanic, Ljubica
    Ivanov, Svetlana
    Guskovic, Dragoslav
    METALURGIA INTERNATIONAL, 2012, 17 (04): : 34 - 38
  • [24] Effect of reflow and thermal aging on the microstructure and microhardness of Sn-3.7Ag-xBi solder alloys
    He, M.
    Acoff, V. L.
    JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (12) : 2098 - 2106
  • [25] Microstructure evolution and mechanical properties of Sn-9Zn-2.5Bi-1.5In solder joints with aging treatment under various conditions
    Gong, Shiliang
    Chen, Gaoqiang
    Qu, Songtao
    Xu, Xun
    Duk, Vichea
    Shi, Qingyu
    Zhang, Gong
    MATERIALS CHARACTERIZATION, 2023, 205
  • [26] Effect of reflow and thermal aging on the microstructure and microhardness of Sn-3.7Ag-xBi solder alloys
    M. He
    V. L. Acoff
    Journal of Electronic Materials, 2006, 35 : 2098 - 2106
  • [27] Effects of Ga, Al, Ag, and Ce multi-additions on the wetting characteristics of Sn-9Zn lead-free solder
    Wang Hui
    Xue Songbai
    Zhao Feng
    Chen Wenxue
    RARE METALS, 2009, 28 (06) : 600 - 605
  • [28] Effects of Sulfur on the Properties of Sn-9Zn as Lead-Free Solder
    Wei, Xiuqin
    Li, Yinghui
    Huang, Huizhen
    JOURNAL OF ELECTRONIC MATERIALS, 2017, 46 (02) : 1067 - 1071
  • [29] Influence of rapid solidification on microstructure, thermodynamic characteristic and the mechanical properties of solder/Cu joints of Sn-9Zn alloy
    Jing, Yanxia
    Sheng, Guangmin
    Zhao, Guoji
    MATERIALS & DESIGN, 2013, 52 : 92 - 97
  • [30] Effect of In Addition on the Microstructure and Mechanical Properties of Sn-0.7Cu-0.8Zn/Cu Solder Joints
    Tu, Wenbin
    Wang, Shanlin
    Chen, Yuhua
    He, Like
    Yang, Chenggang
    Ke, Liming
    JOURNAL OF ELECTRONIC MATERIALS, 2023, 52 (07) : 4775 - 4784
12345