Energy efficiency of low form factor cooling devices

被引:0
|
作者
Arik, Mehmet [1 ]
Petroski, James [1 ]
Bar-Cohen, Avram [1 ]
Demiroglu, Mehmet [1 ]
机构
[1] Gen Elect Global Res, Thermal Syst Lab, Niskayuna, NY 12309 USA
关键词
energy efficient cooling; electronics cooling; thermal management synthetic jets; piezo fans; impingement;
D O I
暂无
中图分类号
O414.1 [热力学];
学科分类号
摘要
With increasing attention to the energy efficiency of consumer and commercial products, thermal engineering and science community is devoting greater effort and attention to the design and implementation of energy-efficient cooling solutions. This study focuses on the cooling potential and Coefficient of Performance, (COP), achievable with three distinct meso-scale cooling technologies, applicable to a wide range of electronics cooling challenges. The thermo-fluid and thermodynamic characteristics of synthetic jets, piezo-driven vibrating blades, and compact muffin fans will be addressed. We are dedicating this paper to Prof. Kakac for his contributions to heat transfer science and technology, developing young scientists, writing highly valuable heat transfer textbooks, and most importantly for his kindness and friendship.
引用
收藏
页码:1347 / 1354
页数:8
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