Low-Temperature Solution-Processed All Organic Integration for Large-Area and Flexible High-Resolution Imaging

被引:10
作者
Hou, Xiao [1 ]
Chen, Sujie [1 ]
Tang, Wei [1 ]
Liang, Jianghu [2 ]
Ouyang, Bang [1 ]
Li, Ming [1 ]
Song, Yawen [1 ]
Shan, Tong [1 ]
Chen, Chun-Chao [2 ]
Too, Patrick [3 ]
Wei, Xiaoqing [4 ]
Jin, Libo [4 ]
Qi, Gang [5 ]
Guo, Xiaojun [1 ]
机构
[1] Shanghai Jiao Tong Univ, Sch Elect Informat & Elect Engn, Shanghai 200240, Peoples R China
[2] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, Shanghai 200240, Peoples R China
[3] FlexEnable, Cambridge CB4 0FX, England
[4] iRay Technol, Shanghai 215000, Peoples R China
[5] Tianma Microelect, Shanghai 201201, Peoples R China
关键词
Organic photodiode; organic thin film transistor; large area; active-matrix imager; flexible electronics; THIN; PHOTODIODES; SENSORS; DESIGN; CAMERA;
D O I
10.1109/JEDS.2022.3142769
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A facile blade-coating process is developed for large area deposition of uniform thick organic active layers in organic photodiodes (OPDs). Large-area semi-transparent top metal electrodes are thermally evaporated with an optimal deposition rate to achieve good balance between transparency and conductivity for top illumination integration structure with the organic thin-film transistor (OTFT) backplane. The maximum process temperature of the OPD is 85 degrees C, so that the performance of the OTFT underneath is not affected. Based on the developed integration structure and processes, an all-organic integrated flexible active-matrix imager is developed, having the largest size (130 mm x 130 mm), highest resolution (1536 x 1536 pixels, 300 ppi) and lowest process temperature (100 degrees C) reported so far for the OPD based imagers.
引用
收藏
页码:821 / 826
页数:6
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