Encapsulation of N,N-diethyl-meta-toluamide (DEET) via miniemulsion polymerization for temperature controlled release

被引:14
作者
Gomes, G. M. [1 ]
Bigon, J. P. [1 ]
Montoro, F. E. [2 ]
Lona, L. M. F. [1 ]
机构
[1] Univ Estadual Campinas, Sch Chem Engn, Dept Mat Engn & Bioproc DEMBio, 500 Albert Einstein Ave, BR-13083852 Sao Paulo, Brazil
[2] Natl Ctr Energy & Mat Res CNPEM, Brazilian Nanotechnol Natl Lab LNNano, 10000 Giuseppe Maximo Scolfaro St, BR-13083970 Campinas, SP, Brazil
基金
巴西圣保罗研究基金会;
关键词
DEET; encapsulation; miniemulsion polymerization; repellent; sustained release; TOXIC ENCEPHALOPATHY; NANOCAPSULES; DRUG; EVAPORATION; FRAGRANCE; MICELLES; SOLVENT;
D O I
10.1002/app.47139
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
N,N-diethyl-meta-toluamide (DEET), an insect repellent, can be successfully encapsulated in poly(n-butyl methacrylate-co-methyl methacrylate) nanospheres via direct miniemulsion polymerization. Stable and low polydisperse nanospheres with a number average diameter of 114 +/- 37nm were obtained. It is shown that DEET is an effective costabilizer and that sodium lauryl sulfate is a suitable surfactant. The nanospheres glass-transition temperature (T-g) can be tuned by adjusting the ratio between n-butyl methacrylate and methyl methacrylate in the monomer formulation. The repellent reduced the polymerization reaction rate and the copolymer molecular weight, and changed the nanoparticle morphology. The release rate of the encapsulated DEET provides repellency for over 9 h and is and more controlled when compared to the free DEET. Results show the mechanism of release is temperature dependent. At temperatures close to and lower than the polymer T-g, polymer relaxation is the limiting mechanism. At higher temperatures, Fickian diffusion limits the overall release. Thus, the DEET release rate can be tuned by adjusting the copolymer T-g. This ensures this material a great potential as temperature-dependent delivery system. (c) 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47139.
引用
收藏
页数:10
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