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- [3] Void Eliminating Process of Sintered-Silver Die Attachment in Anaerobic-Sintering Atmospheres 2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2020,
- [4] The Evolutions of Microstructure in Pressureless Sintered Silver Die Attach Material INTERNATIONAL JOURNAL OF NANOELECTRONICS AND MATERIALS, 2021, 14 (02): : 179 - 194