Signal integrity evaluation of a 10 Gbits/sec optoelectronic interconnect

被引：0

作者：

Kahrs, M ^{[1
]}

Levitan, SP ^{[1
]}

Chiarulli, DM ^{[1
]}

Kurzweg, TP ^{[1
]}

Martínez, JA ^{[1
]}

Boles, J ^{[1
]}

Davare, AJ ^{[1
]}

Jackson, E ^{[1
]}

Windish, C ^{[1
]}

Kiamilev, F ^{[1
]}

Bhaduri, A ^{[1
]}

Taufik, M ^{[1
]}

Wang, XL ^{[1
]}

Morris, AS ^{[1
]}

Repke, J ^{[1
]}

Kruchowski, J ^{[1
]}

Gilbert, BK ^{[1
]}

机构：

[1] Univ Pittsburgh, Dept Elect Engn, Pittsburgh, PA 15261 USA

来源：

2003 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3 | 2003年

关键词：

D O I：

10.1109/MWSYM.2003.1212586

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Signal integrity is of vital importance to high speed interconnects. The 10G system is a 10 Gbit/second optical interconnect with a cross-section bandwidth of over 1T bit/second fabricated on a heterogeneous platform consisting of a multi-chip module, high-speed SiGe and GaAs opto-electronics.. We compare lumped and multisegment microstrip models of the transmission lines on the MCM hybrid. We also modeled the wirebonds using a Quasi-Static model and a Co-Planar Waveguide (CPW) model for the bump bonds between the GaAs and SiGe substrates. These models are utilized by a behavioral simulator to demonstrate the effects of interconnect components on waveform shape. The results demonstrate convincingly that signal integrity is of critical importance to end-to-end performance measures at high transmission speeds and that incorporating these models is important to behavioral simulation.

引用

页码：1211 / 1214

页数：4

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