The advantages of mildly alkaline immersion silver as a final finish for solderability

被引：11

作者：

Fang, Jing Li ^{[1
]}

Chan, Daniel K. ^{[1
]}

机构：

[1] Chartermate Elect Ltd, Hong Kong, Hong Kong, Peoples R China

来源：

CIRCUIT WORLD | 2007年 / 33卷 / 02期

关键词：

alkalinity; silver; soldering; acidity;

D O I：

10.1108/03056120710750940

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Purpose - This study seeks to examine the advantages of mildly alkaline immersion silver as a final finish for solderability in order to combat the shortcomings of acidity in some popular immersion silver solutions. Design/methodology/approach - The paper describes in detail the necessary steps in the mildly alkaline immersion silver process. Findings - The process can overcome the problems of conventional acidic immersion silvers, especially in thermal shock and stress testing. Also it does not affect soldering or aluminium wire bonding. Originality/value - This is arguably a pioneering study in that it posits the benefits of mildly alkaline immersion silver as a final finish for solderability.

引用

页码：43 / 51

页数：9