Carbon Nanostructures Dedicated to Millimeter-Wave to THz Interconnects

被引：14

作者：

Brun, Christophe ^{[1
,2
]}

Wei, Tan Chong ^{[1
,3
]}

Franck, Pierre ^{[1
,2
]}

Chong, Yap Chin ^{[1
,3
]}

Lu Congxiang ^{[1
,3
]}

Leong, Chow Wai ^{[1
,3
]}

Tan, Dunlin ^{[1
,3
]}

Kang, Tay Beng ^{[1
,3
]}

Coquet, Philippe ^{[1
,4
]}

Baillargeat, Dominique ^{[1
,2
]}

机构：

[1] CNRS NTU THALES, CINTRA, UMI 3288, Singapore 637553, Singapore

[2] Univ Limoges, CNRS, XLIM UMR CNRS 7252, F-87060 Limoges, France

[3] Nanyang Technol Univ, Sch Elect & Elect Engn, NOVITAS, Singapore 639798, Singapore

[4] Univ Lille 1, IEMN UMR CNRS 8520, F-59651 Villeneuve Dascq, France

来源：

IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY | 2015年 / 5卷 / 03期

关键词：

Carbon nanotubes; electromagnetic modeling; flip-chip; monopole antennas; nanopackaging; 3-D interconnects; wireless interconnects; NANOTUBES; BUMPS; MODEL;

D O I：

10.1109/TTHZ.2015.2407859

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper focuses on the use of CNTs for new mm-to-THz interconnects for nanopackaging. To successfully integrate CNT to be in line with nanoelectronics trends, new growth processes and modeling approaches are proposed. Several experimental works are presented such as millimeter-wave flip-chip bonding. In addition, novel THz 3-D wireless interconnect, based on CNT monopole antennas, working at 200 and 300 GHz are designed, simulated, and fabricated.

引用

页码：383 / 390

页数：8

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