Creep fracture mechanism of TLP joint of a Ni-base single crystal superalloy

被引:29
作者
Liu, Ji-De [1 ,2 ]
Jin, Tao [1 ]
Li, Wen [3 ]
Sun, Xiao-Feng [1 ]
Guan, Heng-Rong [1 ]
Hu, Zhang-Qi [1 ]
机构
[1] Chinese Acad Sci, Inst Met Res, Dept Superalloy, Shenyang 110016, Peoples R China
[2] Chinese Acad Sci, Grad Sch, Beijing 100039, Peoples R China
[3] Shenyang Ligong Univ, Mat Sci & Engn Coll, Shenyang 110168, Peoples R China
基金
中国国家自然科学基金;
关键词
high temperature alloys; creep property; microstructures; fracture;
D O I
10.1016/j.jallcom.2007.03.019
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
A kind of Ni-base single crystal superalloy was bonded by transient liquid-phase (TLP) process with Ni-Cr-B interlayer. The fracture process of TLP joint during creep test at 982 degrees C/248 MPa was investigated. Results show that due to assemble mismatch or original orientation discrepancy many subgrain boundaries can form in the bonding zone after bonding, and an amount of microporosities nucleate near those subgrain boundaries during creep deformation. With more creep deformation microcracks can initiate at those micropores. Propagation and interconnection of these microcracks result in the failure of TLP joint just at the bonding zone. The reasons for formation of those subgrain boundaries at bonding zone during isothermal solidification are also discussed. (C) 2007 Elsevier B.V. All rights reserved.
引用
收藏
页码:185 / 190
页数:6
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