Interface material mixing formed by the deposition of copper on aluminum by means of the cold spray process

被引：119

作者：

Champagne, VK ^{[1
]}

Helfritch, D ^{[1
]}

Leyman, P ^{[1
]}

Ahl, SG ^{[1
]}

Klotz, B ^{[1
]}

机构：

[1] USA, Res Lab, Weapons & Mat Res Directorate, Aberdeen Proving Ground, MD 21005 USA

来源：

JOURNAL OF THERMAL SPRAY TECHNOLOGY | 2005年 / 14卷 / 03期

关键词：

bond strength; coatings; cold spray;

D O I：

10.1361/105996305X59332

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The objective of this article is to present microstructural evidence of a bonding mechanism between copper, which has been deposited by the cold spray process, and an aluminum substrate. Deposition conditions are varied to determine their effects on the nature of the bond. Mechanical measurements, such as adhesion strength and hardness, as well as visual methods are used to characterize the process. A ballistic model is proposed to explain the process.

引用

页码：330 / 334

页数：5

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