Advanced Application Capabilities of Thick Printed Copper Technology

被引：7

作者：

Hlina, J. ^{[1
]}

Reboun, J. ^{[1
]}

Johan, J. ^{[2
]}

Hamacek, A. ^{[1
]}

机构：

[1] Univ West Bohemia, Dept Technol & Measurement RICE, Fac Elect Engn, Plzen, Czech Republic

[2] Elceram As, Hradec Kralove, Czech Republic

来源：

2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC) | 2019年

关键词：

Thick printed copper; TPC; power electronic substrates; alumina; multilayer structures;

D O I：

10.23919/empc44848.2019.8951789

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper is focused on the advanced capabilities of Thick Printed Copper (TPC) technology used for power electronic substrate manufacturing. TPC technology is based on screen-printing of special copper pastes on ceramic substrates and its firing in a nitrogen atmosphere. This technology can be used as an alternative solution to conventional metallization techniques such as DBC or AMB and enables wide-range interconnection capabilities which cannot be realized with these conventional techniques. TPC interconnection capabilities include multilayer structures, copper plated vias and integrated passive components. Parameters and reliability of above-mentioned TPC structures after accelerated aging and thermal shock cycling are described in this paper.

引用

页数：5

共 8 条

[1]

[Anonymous], 18 EUR MICR PACK C

[2]

Blank T., 2014, P EL SYST INT TECHN, P4

[3]

Gundel P., 2015, PCIM, P19

[4] Study of co-fired multilayer structures based on Thick Printed Copper technology [J].