Radiation Hardened 12T SRAM With Crossbar-Based Peripheral Circuit in 28nm CMOS Technology

被引:9
作者
Han, Yuanyuan [1 ]
Li, Tongde [2 ]
Cheng, Xu [1 ]
Wang, Liang [2 ]
Han, Jun [1 ]
Zhao, Yuanfu [2 ]
Zeng, Xiaoyang [1 ]
机构
[1] Fudan Univ, State Key Lab ASIC & Syst, Shanghai 201203, Peoples R China
[2] Beijing Microelect Technol Inst, Beijing 100076, Peoples R China
基金
中国国家自然科学基金;
关键词
Random access memory; Transistors; Single event upsets; Registers; Redundancy; Radiation hardening (electronics); Decoding; Single event upset; SRAM; peripheral circuits; sense amplifier; read disturbance; MEMORY CELL; SINGLE; VOLTAGE; UPSET; WELL;
D O I
10.1109/TCSI.2021.3074699
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Conventional hardened cells are not robust enough to single event upset (SEU) in 28nm technology due to the scaling of the transistors. High soft error rate is caused by particle striking at cells and logic circuit in SRAM. This work proposes an SEU robust dual access 12T (DA-12T) SRAM with a radiation hardened crossbar-based peripheral circuit (CBPC). The proposed cell with 209% area penalty is more SEU robust than most cells. The CBPC can reduce the read failure rate of SRAMs. The new sense amplifier ensures the correct and rapid reading operation speed when suffering read disturbance. The experiment results show that the SEU cross-section of proposed cell is 60% of standard cell with dummy. Almost no read failure is observed in SRAM with CPBC when operational frequency exceeds 40MHz. Further investigation indicated that DA-12T cell and well isolation technique can reduce the read failure rate.
引用
收藏
页码:2962 / 2975
页数:14
相关论文
共 27 条
[1]   Soft Error Effect Tolerant Temporal Self-Voting Checkers: Energy vs. Resilience Tradeoffs [J].
Alghareb, Faris S. ;
Lin, Mingjie ;
DeMara, Ronald F. .
2016 IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI (ISVLSI), 2016, :571-576
[2]  
Baumann R. C., 2001, IEEE Transactions on Device and Materials Reliability, V1, P17, DOI 10.1109/7298.946456
[3]   Upset hardened memory design for submicron CMOS technology [J].
Calin, T ;
Nicolaidis, M ;
Velazco, R .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1996, 43 (06) :2874-2878
[4]   Compact Measurement Schemes for Bit-Line Swing, Sense Amplifier Offset Voltage, and Word-Line Pulse Width to Characterize Sensing Tolerance Margin in a 40 nm Fully Functional Embedded SRAM [J].
Chen, Yen-Huei ;
Chou, Shao-Yu ;
Li, Quincy ;
Chan, Wei-Min ;
Sun, Dar ;
Liao, Hung-Jen ;
Wang, Ping ;
Chang, Meng-Fan ;
Yamauchi, Hiroyuki .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2012, 47 (04) :969-980
[5]   Effect of well and substrate potential modulation on single event pulse shape in deep submicron CMOS [J].
DasGupta, S. ;
Witulski, A. F. ;
Bhuva, B. L. ;
Alles, M. L. ;
Reed, R. A. ;
Amusan, O. A. ;
Ahlbin, J. R. ;
Schrimpf, R. D. ;
Massengill, L. W. .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2007, 54 (06) :2407-2412
[6]   Basic mechanisms and modeling of single-event upset in digital microelectronics [J].
Dodd, PE ;
Massengill, LW .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2003, 50 (03) :583-602
[7]  
Gregorian R., 1986, ANALOG MOS INTEGRATE, V1st
[8]   Novel Low-Power and Highly Reliable Radiation Hardened Memory Cell for 65 nm CMOS Technology [J].
Guo, Jing ;
Xiao, Liyi ;
Mao, Zhigang .
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2014, 61 (07) :1994-2001
[9]  
Hindman N. D., 2009, 2009 European Conference on Radiation and Its Effects on Components and Systems. 10th RADECS Conference (RADECS 2009), P465, DOI 10.1109/RADECS.2009.5994697
[10]   Impact of Scaling on Neutron-Induced Soft Error in SRAMs From a 250 nm to a 22 nm Design Rule [J].
Ibe, Eishi ;
Taniguchi, Hitoshi ;
Yahagi, Yasuo ;
Shimbo, Ken-ichi ;
Toba, Tadanobu .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2010, 57 (07) :1527-1538