Junction Termination Extension Implementing Drive-in Diffusion of Boron for High-Voltage SiC Devices

被引:28
作者
Bolotnikov, Alexander V.
Muzykov, Peter G. [1 ]
Zhang, Qingchun [2 ]
Agarwal, A. K. [2 ]
Sudarshan, T. S. [1 ]
机构
[1] Univ S Carolina, Dept Elect Engn, Columbia, SC 29208 USA
[2] Cree Inc, Durham, NC 27703 USA
关键词
Boron; diffusion; edge termination; junction termination extension (JTE); silicon carbide (SiC); EDGE TERMINATION; IONIZATION RATES; DESIGN; SILICON; ALUMINUM;
D O I
10.1109/TED.2010.2051246
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A novel method of graded junction termination extension (JTE) formation for high-voltage 4H-SiC power devices is presented. Unlike conventional multiimplantation or tapered thickness mask approaches utilizing several photolithography steps, the new termination technique utilizes a single mask with window areas varied laterally away from the main junction, a single-step boron implantation, and drive-in diffusion at elevated temperature. Numerical device simulations have been performed for the initial JTE structure and mask optimization. 4H-SiC p-i-n rectifiers with an active area of 1 mm x 1 mm were fabricated and characterized. The fabricated devices exhibited 2.5-kV blocking voltage, which is close to the theoretical value of an ideal parallel-plane p-n junction.
引用
收藏
页码:1930 / 1935
页数:6
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