共 19 条
- [11] Mittal K.L., 1975, ADHESION SCI TECHNOL, P129
- [13] NEUMAN S, 1968, J COLLOID INTERF SCI, V26, P209
- [14] RAMIS X, 1997, J POLYM SCI POL LETT, V35, P317
- [16] Numerical stress analysis of resin cracking in LSI plastic packages under temperature cyclic loading .2. Using alloy 42 as leadframe material [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1997, 20 (02): : 176 - 183
- [18] Wu S., 2017, POLYM INTERFACE ADHE
- [19] Residual stresses in plastic IC packages during surface mounting process preceded by moisture soaking test [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1997, 20 (03): : 247 - 255