Analytical solution of thermal resistance of vapor chamber heat sink with and without pillar

被引：43
作者：
Hsieh, Shou-Shing [1 ]
Lee, Ron-Yu
Shyu, Jin-Cherng
Chen, Shao-Wen
机构：
[1] Natl Sun Yat Sen Univ, Dept Mech & Electro Mech Engn, Kaohsiung 80424, Taiwan
[2] Ind Technol Res Inst, Micro Syst Res Lab, Tainan, Taiwan
来源：
ENERGY CONVERSION AND MANAGEMENT | 2007年 / 48卷 / 10期
关键词：
spreading thermal resistance; vapor chamber heat sink; electronic cooling;
D O I：
10.1016/j.enconman.2007.04.022
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
A three dimensional analytical solution using product solutions via the separation of variables for spreading thermal resistances of centrally positioned heat Sources of a vapor chamber heat sink with and without a partition for electronic cooling is presented. Parametric study including partition thickness and height was performed, and the effect of the relevant parameters on the heat transfer performance in terms of the base spreading resistance was examined. (c) 2007 Elsevier Ltd. All rights reserved.
引用
收藏
页码：2708 / 2717
页数：10
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