Influence of adhesion area, applied voltage, and adherend materials on residual strength of joints bonded with electrically dismantlable adhesive

被引:18
作者
Shiote, Hidenao [1 ]
Sekiguchi, Yu [2 ]
Ohe, Manabu [3 ]
Sato, Chiaki [2 ]
机构
[1] Tokyo Inst Technol, Grad Sch, Midori Ku, Yokohama, Kanagawa, Japan
[2] Tokyo Inst Technol, Inst Innovat Res, Midori Ku, 4259 Nagatsuta, Yokohama, Kanagawa 2268503, Japan
[3] Taiyo Wire Cloth Co Ltd, Chuo Ku, Osaka, Japan
关键词
Adherend material; bonding area; constant current; dismantlable adhesive; ElectRelease; separation systems; PERFORMANCE; PARTICLES; BEHAVIOR;
D O I
10.1080/00218464.2017.1305900
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
The separation characteristics of an electrically dismantlable adhesive, ElectRelease, were experimentally investigated. The adhesive has a strength that decreases by applying voltage. The residual strengths of cylindrical butt joints bonded with the adhesive were measured after voltage application. Various experiments were carried out in order to investigate the influences of the bonding area and the type of adherend materials on the residual strength by changing the dimensions and material of the adherends. The influence of constant voltage and current applications was also examined. As a result, it was confirmed that the residual strength of a joint does not depend significantly on the bonding area but on the type of adherend material. The residual strength was able to be determined and predicted by using an areal density of the total charge passing through the bonding area. Higher applied voltage was able to accelerate the decay of the residual strength and shorten the time for a given decrease in strength. The constant current application also induced a decrease in joint strength, which also corresponded to the total charge that could easily be calculated from a duration for current application.
引用
收藏
页码:831 / 854
页数:24
相关论文
共 16 条
[1]   Structural Adhesives Modified with Thermally Expandable Particles [J].
Banea, M. D. ;
da Silva, L. F. M. ;
Carbas, R. J. C. ;
Campilho, R. D. S. G. .
JOURNAL OF ADHESION, 2015, 91 (10-11) :823-840
[2]   Debonding on command of adhesive joints for the automotive industry [J].
Banea, M. D. ;
da Silva, L. F. M. ;
Carbas, R. J. C. .
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2015, 59 :14-20
[3]   Smart Adhesive Joints: An Overview of Recent Developments [J].
Banea, Mariana D. ;
da Silva, Lucas F. M. ;
Campilho, Raul D. S. G. ;
Sato, Chiaki .
JOURNAL OF ADHESION, 2014, 90 (01) :16-40
[4]  
Gilbert M. D., 2004, P INT APPL TECHN C L, P107
[5]  
Gilbert M. D., 2001, [No title captured], Patent No. [WO 01/05584, 0105584]
[6]   ElectRelease - electrically disbonding epoxy adhesive [J].
Haydon, D .
ASSEMBLY AUTOMATION, 2002, 22 (04) :326-328
[7]  
Hogblad J., 2008, THESIS
[8]   Automotive Material Sustainability Through Reversible Adhesives [J].
Hutchinson, Allan R. ;
Winfield, Patricia H. ;
McCurdy, Ryan H. .
ADVANCED ENGINEERING MATERIALS, 2010, 12 (07) :646-652
[9]   Bond strength and disbonding behavior of elastomer and emulsion-type dismantlable adhesives used for building materials [J].
Ishikawa, H ;
Seto, K ;
Shimotuma, S ;
Kishi, N ;
Sato, C .
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2005, 25 (03) :193-199
[10]  
Kishi H., 2006, J. of the Adhesion Society of Japan, V42, P356