Etching of silicon dioxide with gas phase HF and water:: Initiation, bulk etching, and termination

被引：1
|
作者：
Montano-Miranda, Gerardo [1 ]
Muscat, Anthony [2 ]
机构：
[1] Intel Corp, 2501 NW 229th Ave, Hillsboro, OR 97124 USA
[2] Univ Arizona, Tucson, AZ 85721 USA
来源：
ULTRA CLEAN PROCESSING OF SEMICONDUCTOR SURFACES VIII | 2008年 / 134卷
关键词：
surface preparation; gas phase etching; HF; water; surface characterization;
D O I：
10.4028/www.scientific.net/SSP.134.3
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：3 / +
页数：3
相关论文
共 50 条
  • [1] Gas-phase HF/vapor etching of thermal silicon dioxide films
    Montaño-Miranda, G
    Muscat, AJ
    ULTRA CLEAN PROCESSING OF SILICON SURFACES V, 2003, 92 : 207 - 210
  • [2] Silicon surface micromachining by anhydrous HF gas-phase etching with methanol
    Jang, WI
    Choi, CA
    Lee, CS
    Hong, YS
    Lee, JH
    Baek, JT
    Kim, BW
    MICROMACHINING AND MICROFABRICATION PROCESS TECHNOLOGY IV, 1998, 3511 : 143 - 150
  • [3] GAS PHASE ETCHING OF SILICON WITH CHLORINE
    CRAIG, SE
    DISMUKES, JP
    DITTMAN, FW
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1971, 118 (12) : 2034 - &
  • [4] Dimensional etching of silicon and silicon dioxide in a localized gas discharge
    Abramov, AV
    Abramova, EA
    Surovtsev, IS
    TECHNICAL PHYSICS, 2005, 50 (07) : 886 - 890
  • [5] Dimensional etching of silicon and silicon dioxide in a localized gas discharge
    A. V. Abramov
    E. A. Abramova
    I. S. Surovtsev
    Technical Physics, 2005, 50 : 886 - 890
  • [6] GAS-PHASE ETCHING OF SILICON WITH HCL
    KUIJER, TJM
    GILING, LJ
    BLOEM, J
    JOURNAL OF CRYSTAL GROWTH, 1974, 22 (01) : 29 - 33
  • [7] CATALYZED HF VAPOR ETCHING OF SILICON DIOXIDE FOR MICROLITHOGRAPHIC AND NANOLITHOGRAPHIC MASKS
    WHIDDEN, TK
    ALLGAIR, J
    RYAN, JM
    KOZICKI, MN
    FERRY, DK
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1995, 142 (04) : 1199 - 1205
  • [8] GAS-PHASE ETCHING OF SILICON WITH CHLORINE
    DISMUKES, JP
    ULMER, R
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1971, 118 (04) : 634 - &
  • [9] Anisotropic vapor HF etching of silicon dioxide for Si microstructure release
    Passi, Vikram
    Sodervall, Ulf
    Nilsson, Bengt
    Petersson, Goran
    Hagberg, Mats
    Krzeminski, Christophe
    Dubois, Emmanuel
    Du Bois, Bert
    Raskin, Jean-Pierre
    MICROELECTRONIC ENGINEERING, 2012, 95 : 83 - 89
  • [10] Etching mechanism of vitreous silicon dioxide in HF-based solutions
    Knotter, DM
    JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 2000, 122 (18) : 4345 - 4351
12345