Identifying degradation mechanisms in RF MEMS capacitive switches

被引:0
作者
Herfst, R. W. [1 ]
Steeneken, P. G. [1 ]
Schmitz, J. [2 ]
机构
[1] NXP Semicond Corp I&T Res, Eindhoven, Netherlands
[2] Univ Twente, MESA Res Inst, NL-7500 AE Enschede, Netherlands
来源
MEMS 2008: 21ST IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 2008年
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中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper we demonstrate how different degradation mechanisms of RF MEMS capacitive switches can be identified by carefully examining changes in key aspects of the measured C-V curves. We show that C-V curve narrowing can occur either due to mechanical deformation or to laterally inhomogeneous dielectric charging. We also show how these two degradation mechanisms can be distinguished by monitoring the change in the pull-in and pull-out voltages. Our measurements indicate that both degradation mechanisms do indeed occur in practice, depending on the stress conditions.
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页码:168 / +
页数:2
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