Sn addition on the tensile properties of high temperature Zn-4Al-3Mg solder alloys

被引：15

作者：

Cheng, Fangjie ^{[2
,3
]}

Gao, Feng ^{[1
]}

Wang, Yan ^{[2
]}

Wu, Yunlong ^{[2
]}

Ma, Zhaolong ^{[2
]}

Yang, Junxiang ^{[2
]}

机构：

[1] Northwestern Univ, McCormick Sch Engn & Appl Sci, Evanston, IL 60208 USA

[2] Tianjin Univ, Mat Sci & Engn Sch, Tianjin 300072, Peoples R China

[3] Tianjin Key Lab Adv Joining Technol, Tianjin 300072, Peoples R China

来源：

MICROELECTRONICS RELIABILITY | 2012年 / 52卷 / 03期

关键词：

LEAD-FREE SOLDERS; PB-FREE SOLDERS; THERMODYNAMIC CALCULATION; INTERFACIAL REACTIONS; DIE ATTACH; ZN-SN;

D O I：

10.1016/j.microrel.2011.10.003

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The Zn-4Al-3Mg based solder alloy is a promising candidate to replace the conventional Pb-5Sn alloy in high-temperature electronic packaging. In this study, the tensile properties of Zn-4Al-3Mg-xSn alloys (x = 0, 6.8 and 13.2 wt.%) at high temperatures (e.g., 100 degrees C, and 200 degrees C) were investigated. It was found that the uniaxial tensile strength (UTS) of Zn-4Al-3Mg-xSn solder alloys all decrease monotonously with the increment of temperature. The elongation ratio at 100 degrees C is superior to that at room temperature whereas follows a significant drop at 200 degrees C. The microstructure observations show that a typical brittle fracture of Zn-4AI-3Mg alloy occurs at room temperature and 200 degrees C under normal tension, whereas a ductile fracture is found at 100 degrees C. The 6.8 wt.% Sn addition in Zn-4Al-3Mg alloy causes a dramatic decrease of yield strength, and a slight deterioration of the ductility. (C) 2011 Elsevier Ltd. All rights reserved.

引用

页码：579 / 584

页数：6

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