Fabrication of a silicon micro-probe for vertical probe card application

被引：13
|
作者：
Kim, YD [1 ]
Sim, JH
Nam, JW
Lee, JH
机构：
[1] Lumson Co Ltd, R&D Engn Dept, Koyang 411360, South Korea
[2] Korea Maritime Univ, Dept Elect & Commun Engn, Pusan 702701, South Korea
[3] Kyungpook Natl Univ, Sch Elect & Elect Engn, Taegu 702701, South Korea
来源：
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1998年 / 37卷 / 12B期
关键词：
porous silicon micromachining; cantilever tips; probe card; contact resistance; surface tension; thermal expansion coefficient;
D O I：
10.1143/JJAP.37.7070
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
We report on the fabrication of a new type of probe card that uses a porous silicon micromachining technique. Curled cantilever tips are fabricated using surface tension and the difference in the thermal expansion coefficient between the films. The contact resistance of cantilever tips with an aluminum pad is basically below 1 Ohm and there is no change of contact resistance after 700,000 contacts.
引用
收藏
页码：7070 / 7073
页数：4
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