Acceleration of epoxy resin curing by using a combination of aliphatic and aromatic amines

被引:35
作者
Ignatenko, Viktoria Y. [1 ]
Ilyin, Sergey O. [1 ]
Kostyuk, Anna V. [1 ]
Bondarenko, Galina N. [1 ]
Antonov, Sergey V. [1 ]
机构
[1] Russian Acad Sci, AV Topchiev Inst Petrochem Synth, 29 Leninsky Prospekt, Moscow 119991, Russia
关键词
Epoxy resin; Amidoamine; Aliphatic hardeners; Kinetics; Activation energy; DIFFERENTIAL SCANNING CALORIMETRY; MECHANICAL-PROPERTIES; ADHESIVE PROPERTIES; LATENT ACCELERATORS; PHYSICAL-PROPERTIES; PHASE-SEPARATION; CURE KINETICS; NANOCOMPOSITES; AUTOACCELERATION; REINFORCEMENT;
D O I
10.1007/s00289-019-02815-x
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Curing of epoxy resins with aromatic amines, which provides an excellent combination of physical and mechanical properties, requires high temperatures. In this research, the amidoamine adduct of tall oil with triethylenetetramine have been used for acceleration of the reaction of the aromatic amine (diaminodiphenyl sulfone, DDS) with the diglycidyl ether of bisphenol A (DGEBA) epoxy resin. The kinetics of the curing reaction of DGEBA with a mixture of two hardeners was investigated by the non-isothermal DSC method. It was shown that the activation energy of curing decreased from similar to 68 to similar to 59 kJ/mole at amidoamine introduction. Nevertheless, there were no new bands in the IR-spectra of the cured epoxy resins. The acceleration of the curing reaction of the aromatic amine was apparently due to the autocatalytic action of the hydroxyl groups formed by the reaction of the epoxy resin with the amidoamine. Besides acceleration of curing, use of the hardener mixture significantly increased the rubbery-plateau modulus, while not influencing on the value of the elasticity modulus of the cured resin in the glassy state. A disadvantage of using amidoamine for accelerating the curing was lowering of the glass transition temperature of the cured polymer.
引用
收藏
页码:1519 / 1540
页数:22
相关论文
共 50 条
[31]   Curing behavior of dicyandiamide/epoxy resin system using different accelerators [J].
Mehran Hayaty ;
Hengameh Honarkar ;
Mohammad Hosain Beheshty .
Iranian Polymer Journal, 2013, 22 :591-598
[32]   Studies on Curing Kinetics of epoxy resin/modified amine system [J].
Guan, Dongbo ;
Cai, Zhongyi ;
Zhai, Xiaojie ;
Yao, Weiguo ;
Wang, Shoujun ;
An, Hui ;
Qiu, Xiaoming .
ADVANCES IN MATERIALS AND MATERIALS PROCESSING, PTS 1-3, 2013, 652-654 :121-+
[33]   The influence of curing agents in the impact properties of epoxy resin nanocomposites [J].
Amaro, Ana M. ;
Bernardo, Luis ;
Pinto, Deesy G. ;
Lopes, Sergio ;
Rodrigues, Joao .
COMPOSITE STRUCTURES, 2017, 174 :26-32
[34]   The effect of curing temperatures on the thermal behaviour of new polybenzoxazine-modified epoxy resin [J].
Musa, Abdulrahman ;
Alamry, Khalid A. ;
Hussein, Mahmoud A. .
POLYMER BULLETIN, 2020, 77 (10) :5439-5449
[35]   Sustainable glucose-based phenolic resin and its curing with a DGEBA epoxy resin [J].
Zhang, Yongsheng ;
Ferdosian, Fatemeh ;
Yuan, Zhongshun ;
Xu, Chunbao Charles .
JOURNAL OF THE TAIWAN INSTITUTE OF CHEMICAL ENGINEERS, 2017, 71 :381-387
[36]   Kinetic Analysis of the Curing of a Partially Biobased Epoxy Resin Using Dynamic Differential Scanning Calorimetry [J].
Lascano, Diego ;
Quiles-Carrillo, Luis ;
Balart, Rafael ;
Boronat, Teodomiro ;
Montanes, Nestor .
POLYMERS, 2019, 11 (03)
[37]   Curing kinetics of bio-based epoxy resin-toughened DGEBA epoxy resin blend: Synthesis and characterization [J].
Kumar, Sudheer ;
Samal, Sushanta K. ;
Mohanty, Smita ;
Nayak, Sanjay K. .
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, 2019, 137 (05) :1567-1578
[38]   Synthesis of aromatic amine curing agent containing non-coplanar rigid moieties and its curing kinetics with epoxy resin [J].
Qin, Jing ;
Zhang, Guoping ;
Sun, Rong ;
Wong, Chingping .
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, 2014, 117 (02) :831-843
[39]   Influence of aluminosilsesquioxane on epoxy resin curing process [J].
Matykiewicz, Danuta ;
Dudziec, Beata ;
Sterzynski, Tomasz .
POLIMERY, 2014, 59 (11-12) :855-858
[40]   Microencapsulation of imidazole curing agent for epoxy resin [J].
Ham, Young Rok ;
Lee, Dong Ho ;
Kim, Sun Hee ;
Shin, Young Jae ;
Yang, Minhee ;
Shin, Jae Sup .
JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY, 2010, 16 (05) :728-733