Effects of Colloidal Silica on the CMP of Molybdenum in the Alkaline Slurry

被引：0
作者：
Feng, Hui [1 ]
Cao, Li-Ao [1 ]
Feng, Ji-Yu [1 ]
Qu, Xin-Ping [1 ]
机构：
[1] Fudan Univ, Sch Microelect, State Key Lab ASIC & Syst, Shanghai 200433, Peoples R China
来源：
2014 INTERNATIONAL CONFERENCE ON PLANARIZATION/CMP TECHNOLOGY (ICPT) | 2014年
关键词：
SILICOMOLYBDIC ACID; CATALYSTS; OXIDATION;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The effects of colloidal silica on the CMP of Molybdenum (Mo) are investigated in different slurries with H2O2 as oxidizer. It is found that both RR (removal rate) and SER (static etching rate) decrease after adding colloidal silica into the alkaline slurry. The adsorption between the colloidal silica particles and Mo film is observed. Raman spectra show that silicomolybdic acid forms from reaction between colloidal silica and Mo oxide. The mechanism of colloidal silica's inhibition on Mo removal is discussed.
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收藏
页码：66 / 69
页数：4
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