Chemical-Mechanical Polishing of NiP Alloy for Hard Disk Drive Substrates

被引：0

作者：

Lee, Weiming ^{[1
]}

Qi, Zuqiang ^{[1
]}

Lu, Wanjia ^{[1
]}

Luo, Jianbin

机构：

[1] Shenzhen Kaifa Magnet Recording Co Ltd, Shenzhen 518035, Peoples R China

来源：

ADVANCED TRIBOLOGY | 2009年

关键词：

Chemical-mechanical polishing; Hard disk drive substrate; Velocity field; Material remove rate; Roughness; WEAR;

D O I：

10.1007/978-3-642-03653-8_338

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

In this study, the velocity field and the polishing track on the disks for the chemical-mechanical polishing (CMP) process have been simulated, and their effects on material remove rate (MRR) and surface parameters of a polished disk are discussed. The mechanical effects of two slurries (Slurry A and Slurry B) with different abrasive size distribution on the polishing properties and the surface parameters as well as the mechanisms are also studied. An ultra-smooth surface has been achieved with both Slurry A and Slurry B. Average roughness (Ra) by AFM is about 0.11 nm for Slurry A with broad abrasive size distribution, and about 0.09 nm for Slurry B with narrow abrasive size distribution.

引用

页码：1011 / +

页数：2