Micro-bending testing of electrodeposited gold for applications as movable components in MEMS devices

被引：16

作者：

Asano, Keisuke ^{[1
,2
]}

Tang, Hao-Chun ^{[1
,2
]}

Chen, Chun-Yi ^{[1
,2
]}

Nagoshi, Takashi ^{[3
]}

Chang, Tso-Fu Mark ^{[1
,2
]}

Yamane, Daisuke ^{[1
,2
]}

Machida, Katsuyuki ^{[1
,2
,4
]}

Masu, Kazuya ^{[1
,2
]}

Sone, Masato ^{[1
,2
]}

机构：

[1] Japan Sci & Technol Agcy, CREST, Midori Ku, 4259-R2-35 Nagatsuta Cho, Yokohama, Kanagawa 2268503, Japan

[2] Tokyo Inst Technol, Inst Innovat Res, Midori Ku, 4259-R2-35 Nagatsuta Cho, Yokohama, Kanagawa 2268503, Japan

[3] Natl Inst Adv Ind Sci & Technol, Tsukuba, Ibaraki 3058564, Japan

[4] NTT Adv Technol Corp, Atsugi, Kanagawa 2430124, Japan

来源：

MICROELECTRONIC ENGINEERING | 2017年 / 180卷

关键词：

Gold; Mechanical property; Micro-bending test; Hall-fetch relationship; Sample size effect; BEHAVIOR; FILMS;

D O I：

10.1016/j.mee.2017.05.044

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This study reports micro-bending testing results of electrodeposited gold for applications as movable components in MEMS accelerometers. Cold-rolled gold was also evaluated to be used as a comparison with the electrodeposited gold. The specimens evaluated were micro-cantilevers having dimensions of 10 x 10 x 50 mu m(3), which were fabricated by focused ion beam system. The bending test was conducted using a displacement controlled micro-mechanical testing machine developed in our group. Engineering stress-engineering strain curves generated from the micro-bending tests showed there are two types of enhanced mechanism involved during the deformation. One was the sample size effect, which yield stresses of the two micro-cantilevers evaluated in this study were both higher than that of the bulk gold material. Yield stresses of the cold-rolled and electrodeposited gold were 260 and 369 MPa, respectively. The other was the Hall-fetch relationship, which the electrodeposited gold showed a higher yield stress than that of the cold-rolled gold, because the electrodeposited gold has a finer average grain size. Average grain sizes of the cold-rolled and electrodeposited gold were 1.95 and 0.918 mu m, respectively. (C) 2017 Elsevier B.V. All rights reserved.

引用

页码：15 / 19

页数：5

共 18 条

[11]

PETCH NJ, 1953, J IRON STEEL I, V174, P25

[12] Evaluation of the block boundary and sub-block boundary strengths of ferrous lath martensite using a micro-bending test [J].

Shibata, Akinobu ;

Nagoshi, Takashi ;

Sone, Masato ;

Morito, Shigekazu ;

Higo, Yakichi .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2010, 527 (29-30) :7538-7544

[13] Fatigue crack growth behavior of micro-sized specimens prepared from an electroless plated Ni-P amorphous alloy thin film [J].

Takashima, K ;

Higo, Y ;

Sugiura, S ;

Shimojo, M .

MATERIALS TRANSACTIONS JIM, 2001, 42 (01) :68-73

[14] Tensile fracture of integrated single-crystal silicon nanowire using MEMS electrostatic testing device [J].

Tsuchiya, Toshiyuki ;

Hemmi, Tetsuya ;

Suzuki, Jun-ya ;

Hirai, Yoshikazu ;

Tabata, Osamu .

21ST EUROPEAN CONFERENCE ON FRACTURE, (ECF21), 2016, 2 :1405-1412

[15] Sample dimensions influence strength and crystal plasticity [J].

Uchic, MD ;

Dimiduk, DM ;

Florando, JN ;

Nix, WD .

SCIENCE, 2004, 305 (5686) :986-989

[16] ANALYSIS OF THE BENDING BEHAVIOR OF PORCINE XENOGRAFT LEAFLETS AND OF NATURAL AORTIC-VALVE MATERIAL - BENDING STIFFNESS, NEUTRAL AXIS AND SHEAR MEASUREMENTS [J].

VESELY, I ;

BOUGHNER, D .

JOURNAL OF BIOMECHANICS, 1989, 22 (6-7) :655-&

[17] Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samples [J].

Wimmer, A. ;

Smolka, M. ;

Heinz, W. ;

Detzel, T. ;

Robl, W. ;

Motz, C. ;

Eyert, V. ;

Wimmer, E. ;

Jahnel, E. ;

Treichler, R. ;

Dehm, G. .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2014, 618 :398-405

[18] Design of sub-1g microelectromechanical systems accelerometers [J].

Yamane, D. ;

Konishi, T. ;

Matsushima, T. ;

Machida, K. ;

Toshiyoshi, H. ;

Masu, K. .

APPLIED PHYSICS LETTERS, 2014, 104 (07)

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