Micro-bending testing of electrodeposited gold for applications as movable components in MEMS devices

被引：16

作者：

Asano, Keisuke ^{[1
,2
]}

Tang, Hao-Chun ^{[1
,2
]}

Chen, Chun-Yi ^{[1
,2
]}

Nagoshi, Takashi ^{[3
]}

Chang, Tso-Fu Mark ^{[1
,2
]}

Yamane, Daisuke ^{[1
,2
]}

Machida, Katsuyuki ^{[1
,2
,4
]}

Masu, Kazuya ^{[1
,2
]}

Sone, Masato ^{[1
,2
]}

机构：

[1] Japan Sci & Technol Agcy, CREST, Midori Ku, 4259-R2-35 Nagatsuta Cho, Yokohama, Kanagawa 2268503, Japan

[2] Tokyo Inst Technol, Inst Innovat Res, Midori Ku, 4259-R2-35 Nagatsuta Cho, Yokohama, Kanagawa 2268503, Japan

[3] Natl Inst Adv Ind Sci & Technol, Tsukuba, Ibaraki 3058564, Japan

[4] NTT Adv Technol Corp, Atsugi, Kanagawa 2430124, Japan

来源：

MICROELECTRONIC ENGINEERING | 2017年 / 180卷

关键词：

Gold; Mechanical property; Micro-bending test; Hall-fetch relationship; Sample size effect; BEHAVIOR; FILMS;

D O I：

10.1016/j.mee.2017.05.044

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This study reports micro-bending testing results of electrodeposited gold for applications as movable components in MEMS accelerometers. Cold-rolled gold was also evaluated to be used as a comparison with the electrodeposited gold. The specimens evaluated were micro-cantilevers having dimensions of 10 x 10 x 50 mu m(3), which were fabricated by focused ion beam system. The bending test was conducted using a displacement controlled micro-mechanical testing machine developed in our group. Engineering stress-engineering strain curves generated from the micro-bending tests showed there are two types of enhanced mechanism involved during the deformation. One was the sample size effect, which yield stresses of the two micro-cantilevers evaluated in this study were both higher than that of the bulk gold material. Yield stresses of the cold-rolled and electrodeposited gold were 260 and 369 MPa, respectively. The other was the Hall-fetch relationship, which the electrodeposited gold showed a higher yield stress than that of the cold-rolled gold, because the electrodeposited gold has a finer average grain size. Average grain sizes of the cold-rolled and electrodeposited gold were 1.95 and 0.918 mu m, respectively. (C) 2017 Elsevier B.V. All rights reserved.

引用

页码：15 / 19

页数：5

共 18 条

[1]

[Anonymous], 2006, MEMS HDB

[2]

Arnold B., 2003, Microscopy and Microanalysis, V9, P140, DOI 10.1017/S1431927603016027

[3] The mechanical size effect as a mean-field breakdown phenomenon: Example of microscale single crystal beam bending [J].

Demir, Eralp ;

Raabe, Dierk ;

Roters, Franz .

ACTA MATERIALIA, 2010, 58 (05) :1876-1886

[4] Tensile behavior of free-standing gold films. Part I. Coarse-grained films [J].

Emery, RD ;

Povirk, GL .

ACTA MATERIALIA, 2003, 51 (07) :2067-2078

[5] Plasticity size effects in free-standing submicron polycrystalline FCC films subjected to pure tension [J].

Espinosa, HD ;

Prorok, BC ;

Peng, B .

JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, 2004, 52 (03) :667-689

[6]

Green JA, 2006, ARTHRITIS RHEUM-US, V54, P1705, DOI [10.1002/art.21799, 10.1016/j.actamat.2005.12.004]

[7] THE DEFORMATION AND AGEING OF MILD STEEL .3. DISCUSSION OF RESULTS [J].

HALL, EO .

PROCEEDINGS OF THE PHYSICAL SOCIETY OF LONDON SECTION B, 1951, 64 (381) :747-753

[8] Mechanical properties of Au thin film for application in MEMS/NENS using microtensile test [J].

Han, S. W. ;

Lee, H. W. ;

Lee, H. J. ;

Kim, J. Y. ;

Kim, J. H. ;

Oh, C. S. ;

Choa, S. H. .

CURRENT APPLIED PHYSICS, 2006, 6 (SUPPL. 1) :E81-E85

[9] A three-axis micromachined accelerometer with a CMOS position-sense interface and digital offset-trim electronics [J].

Lemkin, M ;

Boser, BE .

IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1999, 34 (04) :456-468

[10] Smaller is stronger: The effect of strain hardening [J].

Maass, R. ;

Van Petegem, S. ;

Ma, Duancheng ;

Zimmermann, Julien ;

Grolimund, Daniel ;

Roters, Franz ;

Van Swygenhoven, H. ;

Raabe, Dierk .

ACTA MATERIALIA, 2009, 57 (20) :5996-6005

← 1 2 →