Thermal and Dielectric Properties of the Aluminum Particle/Epoxy Resin Composites

被引:78
|
作者
Zhou, Wenying [1 ,2 ]
Yu, Demei [1 ,3 ]
机构
[1] Xi An Jiao Tong Univ, State Key Lab Elect Insulat & Power Equipments, Xian 710049, Peoples R China
[2] Xian Univ Sci & Technol, Sch Chem & Chem Engn, Xian 710054, Peoples R China
[3] Xi An Jiao Tong Univ, Sch Sci, Dept Appl Chem, Xian 710049, Peoples R China
基金
中国博士后科学基金;
关键词
thermal properties; dielectric properties; fillers; composites; CONDUCTIVITY; CONSTANT; MICROSTRUCTURE; NANOCOMPOSITE; MODEL;
D O I
10.1002/app.32442
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Microsized aluminum/epoxy resin composites were prepared, and the thermal and dielectric properties of the composites were investigated in terms of composition, aluminum particle sizes, frequency, and temperature. The results showed that the introduction of aluminum particles to the composites hardly influenced the thermal stability behavior, and decreased T of the epoxy resin; moreover, the size, concentration, and surface modification of aluminum particles had an effect on their thermal conductivity and dielectric properties. The dielectric permittivity increased smoothly with a rise of aluminum particle content, as well as with a decrease in frequency at high loading with aluminum particles. While the dissipation factor value increased slightly with an increase in frequency, it still remained at a low level. The dielectric permittivity and loss increased with temperature, owing to the segmental mobility of the polymer molecules. We found that the aluminum/epoxy composite containing 48 vol % aluminum-particle content possessed a high thermal conductivity and a high dielectric permittivity, but a low loss factor, a low electric conductivity, and a higher breakdown voltage. (C) 2010 Wiley Periodicals, Inc. J Appl Polym Sci 118: 3156-3166, 2010
引用
收藏
页码:3156 / 3166
页数:11
相关论文
共 50 条
  • [21] SOME DAMPING PROPERTIES OF ALUMINUM PARTICLE FILLED EPOXY COMPOSITES
    SIERAKOWSKI, R
    HEMP, G
    HOKSTAD, A
    JOURNAL OF COMPOSITE MATERIALS, 1971, 5 (NJUL) : 417 - +
  • [22] Properties of aluminum methylethyl phosphinate/epoxy resin flame retardant composites
    Liu, J. (liuxueqing2000@163.com), 2012, Beijing University of Aeronautics and Astronautics (BUAA) (29):
  • [23] Study on the enhancement of dielectric properties of epoxy resin composites by fullerene doping
    Zhang, Zaizhen
    Zhang, Yuanyuan
    Liu, Hongchang
    Applied Mathematics and Nonlinear Sciences, 2024, 9 (01)
  • [24] The thermal and mechanical properties of graphite foam/epoxy resin composites
    Chen, Xiunan
    Lu, Yonggen
    Zhang, Xin
    Zhao, Fangjia
    MATERIALS & DESIGN, 2012, 40 : 497 - 501
  • [25] Mechanical and dielectric properties of polyether sulfone/epoxy resin - bismaleimide composites
    Guo, Hongyuan
    Chen, Yufei
    Geng, Chengbao
    Yue, Chunyan
    2018 12TH INTERNATIONAL CONFERENCE ON THE PROPERTIES AND APPLICATIONS OF DIELECTRIC MATERIALS (ICPADM 2018), 2018, : 270 - 274
  • [26] Thermal and Dielectric Properties of the Aluminum Particle Reinforced Linear Low-Density Polyethylene Composites
    Zhou, Wenying
    POLYMER ENGINEERING AND SCIENCE, 2011, 51 (05): : 917 - 924
  • [27] THERMAL-EXPANSION OF EPOXY-RESIN-PARTICLE COMPOSITES - SIZE EFFECT
    PINHEIRO, MDFF
    ROSENBERG, HM
    JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS, 1980, 18 (02) : 217 - 226
  • [28] Enhanced dielectric permittivity of BaTiO3/epoxy resin composites by particle alignment
    Kim, Dong Seok
    Baek, Changyeon
    Ma, Ho Jin
    Kim, Do Kyung
    CERAMICS INTERNATIONAL, 2016, 42 (06) : 7141 - 7147
  • [29] Dielectric and Thermal Properties of Boron Nitride and Silica Epoxy Composites
    Couderc, H.
    Frechette, M.
    Savoie, S.
    Reading, M.
    Vaughan, A. S.
    CONFERENCE RECORD OF THE 2012 IEEE INTERNATIONAL SYMPOSIUM ON ELECTRICAL INSULATION (ISEI), 2012, : 64 - 68
  • [30] Dielectric and thermal properties of epoxy/boron nitride nanotube composites
    Zhi, Chunyi Y.
    Bando, Yoshio
    Terao, Takeshi
    Tang, Chengchun
    Golberg, Dmitri
    PURE AND APPLIED CHEMISTRY, 2010, 82 (11) : 2175 - 2183