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Plasma treatment of HfO2-based metal-insulator-metal resistive memories
被引:10
作者:
Vallee, C.
[1
]
Gonon, P.
[1
]
Mannequin, C.
[1
]
Chevolleau, T.
[1
]
Bonvalot, M.
[1
]
Grampeix, H.
[2
]
Licitra, C.
[2
]
Rochat, N.
[2
]
Jousseaume, V.
[2
]
机构:
[1] UJF, CNRS, UMR 5129, LTM, F-38054 Grenoble 9, France
[2] CEA LETI Minatec, F-38054 Grenoble, France
来源:
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A
|
2011年
/
29卷
/
04期
关键词:
LAYER;
MECHANISMS;
DIFFUSION;
HFO2;
D O I:
10.1116/1.3599825
中图分类号:
TB3 [工程材料学];
学科分类号:
0805 ;
080502 ;
摘要:
This work focuses on Au/HfO2/TiN nonvolatile resistive memory [ resistive random access memories (RRAMs)] stacks, where HfO2 is deposited by the atomic layer deposition technique on TiN electrodes. For as-grown RRAMs, no Reset is observed (the structure remains locked in a low resistive state). It is observed that an NH3 plasma treatment of the HfO2/TiN bilayer can restore a Reset stage. X-ray photoelectron spectroscopy analyses showed that the Reset recovery is related to a modification of the HfO2/TiN interface via transformation of the TiON interfacial layer. Thus, postdeposition plasma treatments of the oxide/ electrode interface are identified as a valuable tool to improve the switching properties of oxide-based RRAMs. (C) 2011 American Vacuum Society. [DOI: 10.1116/1.3599825]
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页数:6
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