Manufacturing issues of thin film NiTi microwrapper

被引:117
作者
Gill, JJ
Chang, DT
Momoda, LA
Carman, GP
机构
[1] Univ Calif Los Angeles, Sch Engn, Mech & Aerosp Engn Dept, Los Angeles, CA 90095 USA
[2] HRL Labs, Malibu, CA 90265 USA
关键词
shape memory alloy; NiTi; transformation temperatures; ion-milling;
D O I
10.1016/S0924-4247(01)00646-X
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Manufacturing issues related to a thin film NiTi shape memory alloy (SMA) microactuator (i.e. microwrapper) have been investigated using both wet and dry etching techniques. Results show that wet etching the amorphous film produces a cleaner pattern than the crystallized film. Transformation temperatures are not affected by the pre-exposure of the NiTi film to air before crystallization. However, this process produces breakage in the NiTi film at sacrificial layer steps. This is believed to be due to residual stresses developed between the film and substrate during sputtering. The film breakage is overcome by dry etching the film with an ion-milling technique. Curvature in the microwrapper arms is induced using either a bi-layer material (i.e. polyimide and NiTi) or a functionally gradated NiTi film. Results show that when heated the microwrapper arms flatten due to shape memory effect and curl up to form a cage-like structure when cooled. (C) 2001 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:148 / 156
页数:9
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