Effect of intermetallic compound layer development on mechanical strength of 63Sn-37Pb solder joints

被引:0
作者
Kishimoto, K [1 ]
Masuda, K [1 ]
Omiya, M [1 ]
Shibuya, T [1 ]
Amagai, M [1 ]
机构
[1] Tokyo Inst Technol, Dept Mech & Intelligent Syst Engn, Meguro Ku, Tokyo 1528552, Japan
来源
MICRO MATERIALS, PROCEEDINGS | 2000年
关键词
intermetallic compound; solder joints; tensile strength; thermal aging;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The purpose of this paper is to investigate the growth of the intermetallic compounds and its effect on the mechanical strength of 63Sn-37Pb solder joints. After aging for the 63Sn-37Pb solder joints, tensile tests were performed. From SEM microscope observation and EDX microprobe analysis, the growth and components of the intermetallic compounds layer were examined. These results suggest that the interfacial strength depends strongly on the mechanical properties of intermetallic compounds generated, and the effects of the intermetallic compounds on the interfacial strength become a limit state when their thickness exceed a certain critical value.
引用
收藏
页码:560 / 565
页数:6
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