Thermodynamic Analysis in Failure Analysis of 3D Stacked Package Devices

被引：0

作者：

Wang, Xu ^{[1
]}

Ding, Zhimin ^{[1
]}

Duan, Chao ^{[1
]}

Meng, Meng ^{[1
]}

Liu, Yudong ^{[1
]}

Wang, Zhibin ^{[1
]}

Yu, Xiangtian ^{[1
]}

机构：

[1] China Aerosp Components Engn Ctr, Beijing, Peoples R China

来源：

2021 THE 6TH INTERNATIONAL CONFERENCE ON INTEGRATED CIRCUITS AND MICROSYSTEMS (ICICM 2021) | 2021年

关键词：

3D stacked packaging; plating cracks; thermal stability; TMA;

D O I：

10.1109/ICICM54364.2021.9660285

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Three-dimensional(3D) stacked packaging devices use epoxy packaging materials to integrate multiple components or chips in the vertical direction, and adopt various new interconnection technologies to realize the vertical interconnection of components. This article introduces a case of cracking on the surface coating of a 3D stacked package component with a vertical electrical connection by the surface metal coating. Through the analysis of the stacked packaging material and discussion of the process, the failure mechanism is clearly obtained and the cause of the failure was found out. Finally, several quality assurance methods to ensure the epoxy curing quality of epoxy-encapsulated 3D devices are given.

引用

页码：137 / 141

页数：5

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