Optimum design of W/Cu functionally graded material for thermal stress mitigation

被引：0
作者：
Ling, YH
Bai, XD
Li, JT
Ge, CC
机构：
[1] Tsinghua Univ, Beijing 100084, Peoples R China
[2] Univ Sci & Technol Beijing, Beijing 100083, Peoples R China
来源：
RARE METAL MATERIALS AND ENGINEERING | 2003年 / 32卷 / 12期
关键词：
functionally graded material; plasma facing material; tungsten; finite element analysis; thermal stress mitigation;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Optimum design of W/Cu FGM for thermal stress mitigation by using finite element analysis (FEA) was conducted in this paper. The results show that a 62.3% reduction of equivalent Von Mises thermal stress in a optimum-design W/Cu FGM is obtained and its surface working temperature is a 50degreesC fall compared with non-FGM under heat flux of 30 MW/m(2), while compared with monolithic W plasma facing material, a remarkable 445degreesC decline of surface temperature of W/Cu FGM is found.
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收藏
页码：976 / 980
页数：5
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