Enthalpies of mixing of liquid systems for lead-free soldering: Cu-Sb-Sn system

被引：10

作者：

Jendrzejczyk-Handzlik, Dominika ^{[1
]}

Rechchach, Meryem ^{[2
,3
]}

Gierlotka, Wojciech ^{[1
,4
]}

Ipser, Herbert ^{[3
]}

Flandorfer, Hans ^{[3
]}

机构：

[1] Univ Sci & Technol Krakow, Fac Nonferrrous Met, PL-30059 Krakow, Poland

[2] Univ Mohammed 5, Fac Sci, Lab Chim Phys Gen, Rabat, Morocco

[3] Univ Vienna, Dept Inorgan Chem Mat Chem, A-1090 Vienna, Austria

[4] Yuan Ze Univ, Dept Chem Engn & Mat Sci, Chungli, Taiwan

来源：

THERMOCHIMICA ACTA | 2011年 / 512卷 / 1-2期

基金：

奥地利科学基金会;

关键词：

Cu-Sb-Sn system; Enthalpy of mixing; THERMODYNAMIC DESCRIPTION; BINARY-ALLOYS; COPPER; TEMPERATURE; DEPENDENCE; ANTIMONY; ORDER; HEAT; TIN;

D O I：

10.1016/j.tca.2010.10.010

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Using two different types of high temperature drop calorimeters, partial and integral enthalpies of mixing of liquid alloys were determined in the ternary Cu-Sb-Sn system. The system was investigated along four sections at 1100 K. Experimental data were used to find ternary interaction parameters by applying the Redlich-Kister-Muggianu model for substitutional solutions, and a full set of parameters describing the concentration dependence of the enthalpy of mixing was derived. From these, the isoenthalpy curves were constructed for 1100 K. The entire system shows exothermic enthalpy of mixing at the given temperature. (C) 2010 Elsevier B.V. All rights reserved.

引用

页码：217 / 224

页数：8

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