Behavior of polysilicon thin-film transistors at different temperatures

被引:0
作者
Llibre, JF
Toutah, H
Tala-Ighil, B
Boudart, B
Mohammed-Brahim, T
Bonnaud, O
机构
[1] LUSAC, F-50130 Octeville, France
[2] Univ Rennes 1, UMR CNRS 6164, IETR, GM, F-35042 Rennes, France
来源
POLYCRYSTALLINE SEMICONDUCTORS VII, PROCEEDINGS | 2003年 / 93卷
关键词
material quality; polycrystalline silicon; reliability; thin-film transistor;
D O I
10.4028/www.scientific.net/SSP.93.67
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A correlation between the material quality of the undoped polysilicon active layer of Thin Film Transistors and the behavior of the transistor parameters at different temperature is highlighted in this study. With low quality material, the transconductance g(m) decreases monotonically with decreasing temperatures. Such behavior originates from the scattering at the grain boundaries, which is predominant even at high temperature. With high quality material, g(m) increases with decreasing temperatures in the high temperature range and then becomes constant, independent of the temperature, in the low temperature range. At high temperature, the thermal scattering is predominant as in single crystalline MOSFET.
引用
收藏
页码:67 / 72
页数:6
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