Effect of rapid inducted heating on the microstructure of solder joint in IC

被引：0

作者：

Chen, Jibing ^{[1
]}

Wan, Nong ^{[1
]}

Li, Juying ^{[1
]}

He, Zhanwen ^{[1
]}

Wu, Yiping ^{[2
]}

机构：

[1] Wuhan Polytech Univ, Sch Mech Engn, Wuhan, Hubei, Peoples R China

[2] Huazhong Univ Sci & Technol, Ctr Connecting & Elect Packaging, Wuhan Natl Lab Optoelect, Wuhan, Hubei, Peoples R China

来源：

2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2018年

关键词：

lead-free joint; rapid thermal cycling; microstructure; IMC; electronic packaging; FATIGUE; BEHAVIOR; MODELS;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This experiment mainly study the influence of the thermal fatigue of solder joint, solder was - Cu and Sn, Pb, Sn - Ag is 760 microns in diameter, welding plate of 560 microns. Internationally accepted tin-lead solder is most likely to replace the Sn Ag - Cu alloy series.In order to study the temperature and stress under the dual function of single substrate BGA solder joint in the process of thermal fatigue deformation process, organizational structure evolution, establishing the model of fatigue study solder joint fatigue mechanism; Find out fast cyclic heating and fast cooling the coupling mechanism of solder joint fatigue and solder joint interface evolution process. First of all, experimental apparatus mainly has a high frequency current box, catheter, relay and thermocouple. Under the condition of rapid heating and rapid cooling, the thermal fatigue behavior of single substrate.

引用

页码：815 / 818

页数：4

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