Use of copper ink for fabricating conductive electrodes and RFID antenna tags by screen printing

被引：101

作者：

Kim, Yoonhyun ^{[2
]}

Lee, Byoungyoon ^{[3
]}

Yang, Seungnam ^{[3
]}

Byun, Inho ^{[4
]}

Jeong, Inbum ^{[3
]}

Cho, Sung Min ^{[1
]}

机构：

[1] Sungkyunkwan Univ, Sch Chem Engn, Suwon 440746, South Korea

[2] SKKU Adv Inst Nano Technol SAINT, Suwon 440746, South Korea

[3] ChangSung Co Ltd, R&D Ctr, Inchon, South Korea

[4] Donghyun Elect Corp, R&D Ctr, Pyeongtaek, Kyeonggi Do, South Korea

来源：

CURRENT APPLIED PHYSICS | 2012年 / 12卷 / 02期

关键词：

Copper ink; Metal film; Low temperature curing; RFID antenna; SILVER; NANOPARTICLES; METALLIZATION; TEMPERATURE;

D O I：

10.1016/j.cap.2011.08.003

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We have synthesized nano-sized copper hydroxide powder and copper (II) neodecanoate complex that can be decomposed to form copper metal films. Copper conductive ink was then prepared by mixing the powder and complex with a binder in terpineol. The lowest resistivity of 12.5 mu Omega cm and 5B level of adhesion strength were obtained with 5% addition of epoxy resin as a binder. The copper ink was then applied to fabricate a loop-type RFID antenna tag and the performance of the antenna was compared with that of conventional copper-etched and silver-paste antenna. The fabricated RFID antenna showed comparable performance to the conventional RFID antenna. (C) 2011 Elsevier B. V. All rights reserved.

引用

页码：473 / 478

页数：6

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