Simulation and experimental characterization of microporosity during solidification in Sn-Bi alloys

被引:9
作者
Siroky, Georg [1 ]
Kraker, Elke [1 ]
Kieslinger, Dietmar [2 ]
Kozeschnik, Ernst [3 ]
Ecker, Werner [1 ]
机构
[1] Mat Ctr Leoben Forsch GmbH MCL, Roseggerstr 12, A-8700 Leoben, Austria
[2] ZKW Elekt GmbH, Samuel Morse Str 18, A-2700 Wiener Neustadt, Austria
[3] TU Wien, Inst Mat Sci & Technol, Getreidemarkt 9, A-1060 Vienna, Austria
关键词
Solder; Computed tomography; Morphology; Porosity; RVE; FEM; Semi-solid; Solidification; MECHANICAL-PROPERTIES; CRACKING SUSCEPTIBILITY; INTERFACIAL BEHAVIOR; TENSILE PROPERTIES; THERMAL EXPANSION; ALUMINUM-ALLOYS; CREEP-BEHAVIOR; SOLDER JOINTS; MICROSTRUCTURE; AG;
D O I
10.1016/j.matdes.2021.110258
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The formation of microporosity during solidification of Sn-Bi alloys is investigated through experiments and simulations. Samples of varying composition with 20, 30, 47 and 58 wt% Bi are solidified in a copper mould and the pore fraction is measured through scanning electron microscopy. Finite element models are derived from X-ray micro computed tomography data and a material model is implemented to capture the effect of liquid pressure and volumetric swelling. The experimental assessment of solidification porosity shows a strong dependency on alloy composition. The round morphology of porosity found in the Sn-20 wt% Bi alloy indicates its formation in the terminal stage of solidification. Microporosity formation is computed by means of Finite Element simulations and the results correlate with experimental findings. The analysis confirms volumetric shrinkage in the liquid state of confined eutectic domains as the mechanism for pore formation and determines the composition dependency of Sn-Bi alloys. (c) 2021 The Authors. Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
引用
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页数:12
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