Polyimide composites containing core @shell particles with high dielectric constant and low dielectric loss

Flake graphite @polyimide (FG@PI) particles with core @shell like structure were successfully synthesized and subsequently incorporated into PI matrix to prepare pI/FG@PI composite films. The scanning electron microscope (SEM) and transmission electron microscope (TEM) images showed that flake graphite (FG) was covered by PI coating and showed a fluffy structure. Thermogravimetric analysis (TGA), FT-IR, and XRD were also used to characterize FG@PI particles. The PI intermediate layer increases interaction between particles and films, which is very beneficial for increasing dielectric constant and inhibiting dielectric loss of pI/FG@PI composite. The experimental result shows that the pI/FG@PI composite film with 50wt% filler loading exhibits a high dielectric constant of 83.5 (about 24 times that of pure PI) and low dielectric loss of 0.11 at 1 MHz. Furthermore, its tensile strength is maintained at 78 MPa. This shows that the structure of PI intermediate layer is very beneficial for preparation of high dielectric constant and low dielectric loss composite.