Wettability of PdNi(Co)-Cr alloys on Si3N4 ceramic and joining of Si3N4 to Si3N4

被引:3
|
作者
Xiong, Hua-Ping [1 ]
Chen, Bo [1 ]
Guo, Wan-Lin [1 ]
Ye, Lei [1 ]
机构
[1] Beijing Inst Aeronaut Mat, Lab Welding & Forging, Beijing 100095, Peoples R China
基金
中国国家自然科学基金;
关键词
Ceramics; Wettability; Brazing; Strength; SILICON-NITRIDE CERAMICS; FILLER ALLOY; NI; MICROSTRUCTURE; SI; CR;
D O I
10.1007/s40194-014-0175-2
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
Eight kinds of PdNi(Co)-Cr alloys were designed, and their wettability on Si3N4 ceramic was studied with the sessile drop method. Under the vacuum heating condition of 1,523 K/30 min, Pd60-Ni40 alloy showed a contact angle of 28 degrees on Si3N4 ceramic, and the reaction band between it and the Si3N4 consisted of the mixture of (Pd, Ni) solid solution and (Pd, Ni)-silicides. It was found that Cr addition into the Pd-Ni alloys further improved their wettability. Pd60-Co40 alloy gave a contact angle of 134 degrees. When 8 wt.% Cr was added into Pd-Co alloy, its contact angle was remarkably decreased to 44 degrees. The reaction products at the interfaces were examined by SEM equipped with an X-ray energy-dispersive spectrometer, and the corresponding interfacial reaction mechanism was also discussed. The formation of Pd2Si is evident at the interfaces. PdCo(Ni,Si,B)-(20 similar to 25)Cr alloy was designed as a filler metal and was produced into filler foils by a rapidly-solidifying technique, and they were used for the brazing of Si3N4/Si3N4. The Si3N4/Si3N4 joints brazed at 1,523 K for 10 min exhibited an average three-point bend strength of 107.7 MPa at room temperature.
引用
收藏
页码:33 / 44
页数:12
相关论文
共 50 条
  • [31] Wettability and infiltration of Si drop on silica substrate containing α-Si3N4 coating: Influence of oxygen content in α-Si3N4 coating
    Wang, Qinghu
    He, Gang
    Deng, Shuxiang
    Liu, Jun
    Li, Jiangtao
    Li, Yawei
    Pan, Liping
    Liu, Guanghua
    Li, Xiaoyu
    Li, Jianqiang
    CERAMICS INTERNATIONAL, 2020, 46 (08) : 12695 - 12704
  • [32] Effects of β-Si3N4 Seeds on Microstructure and Performance of Si3N4 Ceramics in Semiconductor Package
    Shen, Qiang
    Lin, Zhijie
    Deng, Junjie
    Chen, Hongxiang
    Chen, Xuan
    Tian, Jun
    Bao, Biliang
    Dai, Pinqiang
    Sun, Xudong
    MATERIALS, 2023, 16 (12)
  • [33] Si3N4 with comparable permeability to SiC
    Park, Young-Jo
    Song, In-Hyuck
    JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2012, 32 (02) : 471 - 475
  • [34] Crystallization Behavior of Amorphous Si3N4 and Particle Size Control of the Crystallized α-Si3N4
    Chung, Yong-Kwon
    Kim, Shin-A
    Koo, Jae-Hong
    Oh, Hyeon-Cheol
    Chi, Eun-Ok
    Hahn, Jee-Hyun
    Park, Chan
    JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2016, 16 (05) : 5403 - 5409
  • [35] Effect of holding time on microstructure and properties of dense α-Si3N4/Sialon composite coating on porous Si3N4 ceramic
    Wang, Chao
    Qiao, Ruiqing
    Xiao, Li
    Chen, Lijia
    CERAMICS INTERNATIONAL, 2016, 42 (15) : 17513 - 17517
  • [36] Wettability Improvement and Brazing of Si3N4 by Sputtered Al
    Liu Geliang
    Ma Bingyang
    Shang Hailong
    Chen Fan
    Li Rongbin
    Li Geyang
    ACTA METALLURGICA SINICA, 2017, 53 (12) : 1645 - 1650
  • [37] Mechanical properties of Si3N4 ceramics from an in-situ synthesized a-Si3N4/β-Si3N4 composite powder
    Xing, Hongyu
    Liu, Bingqiang
    Sun, Jing
    Zou, Bin
    CERAMICS INTERNATIONAL, 2017, 43 (02) : 2150 - 2154
  • [38] Densification of Si3N4/Si3N4-fibre composites
    Osendi, MI
    Miranzo, P
    CMMC 96 - PROCEEDINGS OF THE FIRST INTERNATIONAL CONFERENCE ON CERAMIC AND METAL MATRIX COMPOSITES, PTS 1 AND 2, 1997, 127-3 : 247 - 254
  • [39] Preparation and properties of Si3N4 3 N 4 ceramics via vat photopolymerization using Si3N4 3 N 4 powders coated with bowl-like boehmite
    Wang, Qi-Wen
    Wu, Jia-Min
    Tian, Chong
    Shi, Zhang-Ao
    Liu, Chun-Lei
    Lin, Xin
    Xu, Hai-Sheng
    Wang, Fen
    Shi, Yu-Sheng
    ADDITIVE MANUFACTURING, 2024, 84
  • [40] Microstructure evolution of Si3N4/Si3N4 joint brazed with Ag-Cu-Ti plus SiCp composite filler
    Zhang, J.
    He, Y. M.
    Sun, Y.
    Liu, C. F.
    CERAMICS INTERNATIONAL, 2010, 36 (04) : 1397 - 1404