WIRE-BONDING-BASED VERTICAL MICROPROBE ELECTRODE ARRAYS INTEGRATED ONTO HIGH-DENSITY MICROELECTRODE ARRAYS WITH ACTIVE CIRCUITRY FOR EXTRACELLULAR RECORDING

被引：0

作者：

Hidaka, S. ^{[1
]}

Obien, M. E. J. ^{[2
]}

Frey, U. ^{[2
]}

Konishi, S. ^{[1
]}

机构：

[1] Ritsumeikan Univ, Shiga, Japan

[2] RIKEN Quantitat Biol Ctr, Kobe, Hyogo, Japan

来源：

2015 TRANSDUCERS - 2015 18TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS) | 2015年

关键词：

Vertical microprobe electrode arrays; wire-bonding; preamplifier; micro electrode arrays;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a novel wire-bonding technology to manufacture vertical microprobe electrode arrays with uni-form tip heights for electrophysiological measurement. The tips of gold microprobes coated with parylene are exposed and leveled at the same time by polishing. Sacrificial supporting material reinforces the probes during polishing. Furthermore, the vertical microprobes are interfaced onto high-density microelectrode arrays (HDMEAs) with active circuitry for amplification and digitization in order to improve signal-to-noise ratio (SNR). The height and diameter of the fabricated vertical microprobes are 150 mu m and 31 mu m, respectively. The microprobes were evaluated by impedance spectroscopy and chronoamperometric measurements. 75 vertical microprobes were successfully attached on an HDMEA to connect to the on-chip amplification chain. Finally, the microprobes were used to record neuronal signals in an acute cerebellar slices.

引用

页码：2232 / 2235

页数：4

共 7 条

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