An environmental comparison of packaging and interconnection technologies

被引：10

作者：

Nissen, NF ^{[1
]}

Griese, H ^{[1
]}

Middendorf, A ^{[1
]}

Muller, J ^{[1
]}

Potter, H ^{[1
]}

Reichl, H ^{[1
]}

机构：

[1] Fraunhofer Inst Reliabil & Microintegrat, Dept Environm Engn, IZM, Berlin, Germany

来源：

PROCEEDINGS OF THE 1998 IEEE INTERNATIONAL SYMPOSIUM ON ELECTRONICS AND THE ENVIRONMENT | 1998年

关键词：

D O I：

10.1109/ISEE.1998.675040

中图分类号：

X [环境科学、安全科学];

学科分类号：

08 ; 0830 ;

摘要：

Packaging and interconnection are driving forces behind the miniaturization of electronics. Since miniaturization means less use of resources this trend seems inherently environmentally benign. Adverse effects may overlay this simple truth, The investments for new production facilities rise, the complexity and closeness of non-separable compounds in electronic products increase and the amount and applications of electronic goods multiply. The goal must be to influence new technology developments as early as possible to ensure that the balance of the listed effects remains positive for the environment. As a first step in this direction a simple comparison of different interconnection options is made which Is based on the material content of the different printed circuit board assemblies.

引用

页码：106 / 111

页数：6

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