Optimization of Process Parameters in Lead-free Wave Soldering Based on Orthogonal Experiment and Analytic Hierarchy Process

被引：4
|
作者：
Yin, Fengfu [1 ]
Zhang, Xihua [1 ]
Wang, Hailong [1 ]
Yu, Suiran [2 ]
机构：
[1] Haier Grp Co, R&D Ctr, Qingdao 266103, Peoples R China
[2] Shanghai Jiao Tong Univ, Sch Mech Engn, Shanghai 200240, Peoples R China
来源：
ADVANCED MECHANICAL ENGINEERING, PTS 1 AND 2 | 2010年 / 26-28卷
基金：
中国国家自然科学基金;
关键词：
Orthogonal experiment; Analytic hierarchy process(AHP); Lead-free wave soldering; Process parameters; Printed circuit board(PCB);
D O I：
10.4028/www.scientific.net/AMM.26-28.641
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In order to solve the typical soldering defects in lead-free wave soldering, the Design of Experiment(DOE) was conducted to optimize the process parameters. Based on the printed circuit board(PCB) experimental results, the method of Analytic Hierarchy Process(AHP) was employed to analyze the experiment results quantitatively. Then the influential weights of each factor in different levels were obtained. It is concluded that the influential sequences of the four main process parameters in lead-free wave soldering are track speed, flux quantity, soldering temperature and preheat temperature; the optimal process parameters are as follows: flux quantity 40mL.min(-1), preheat temperature 110 degrees C, track speed 1.6mL.min(-1), soldering temperature 265 C. Furthermore, the reasons of solder bridging and missing weld defects were discussed systematically according to the analysis results. This paper reveals the key direction to optimize the process parameters and provides an effective measure to improve the soldering quality in lead-free wave soldering.
引用
收藏
页码：641 / +
页数：3
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