Suppressing Ni3Sn4 formation in the Sn-Ag-Cu solder joints with Ni-P/Pd/Au surface finish

被引：50

作者：

Tseng, Chien-Fu ^{[1
]}

Lee, Tae-Kyu

Ramakrishna, Gnyaneshwar

Liu, Kuo-Chuan

Duh, Jenq-Gong ^{[1
]}

机构：

[1] Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan

来源：

MATERIALS LETTERS | 2011年 / 65卷 / 21-22期

关键词：

Lead-free solder; ENIG; ENEPIG; Intermetallic alloys and compounds; Kirkendall voids; Phase transformation; FLIP-CHIP TECHNOLOGY; BUMP METALLIZATION; SUBSTRATE; GROWTH; LAYER;

D O I：

10.1016/j.matlet.2011.07.015

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The interfacial reactions of Sn-3.0Ag-0.5Cu solder jointed with electroless Ni-P/immersion Au (ENIG) and electroless Ni-P/electroless Pd/immersion Au (ENEPIG) were investigated. Cu6Sn5 grew rather slower in ENEPIG samples among all aging conditions as compared with ENIG. Furthermore, the second phase. Ni3Sn4, started to form in the ENIG aged joints, but not in the ENEPIG aged joints. It was demonstrated that ENEPIG could inhibit the formation of Ni3Sn4, which further decreased the growth of columnar Kirkendall voids inside the Ni3P layer. With less voids formed in the Ni3P layer, it is expected that the reliability of ENEPIG joints would be superior to that of ENIG joints. Detailed mechanisms of Ni3Sn4 suppression and void formation were discussed and proposed. (C) 2011 Elsevier B.V. All rights reserved.

引用

页码：3216 / 3218

页数：3

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