The constitutive creep equation for a eutectic Sn-Ag alloy using the modified theta-projection concept

被引:29
|
作者
Kariya, Y [1 ]
Otsuka, M
Plumbridge, WJ
机构
[1] Natl Inst Mat Sci, Ecomat Ctr, Tsukuba, Ibaraki 3050044, Japan
[2] Shibaura Inst Technol, Mat Engn & Sci Dept, Tokyo 1088548, Japan
[3] Open Univ, Mat Engn Dept, Milton Keynes MK7 6AA, Bucks, England
关键词
creep; nonsteady state; Sn-3.5Ag; lead-free solder; theta projection; constitutive equation;
D O I
10.1007/s11664-003-0107-1
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Creep data for a eutectic tin-silver alloy at temperatures between 298 K and 398 K have been analyzed using the modified theta-projection concept, instead of the steady-state creep constitutive equation in the following formula: epsilon(cr) = A {1 - exp(-alphat)} + B {exp(alphat) - 1}, where A, B, and alpha are constants to be experimentally determined. The equation describes well the creep curves of the eutectic tin-silver alloy up to the tertiary stage. All constants exhibited power law relationships with the applied stress. The rate constant, alpha, has a high stress exponent, which is attributed to dispersion strengthening. The rate constant a and the strain factor B only showed temperature dependence, while the strain factor A was independent of temperature. The activation energy for a was 65 kJ/mol at high stresses and 90 kJ/mol at low stresses. The energies suggest that the dislocation pipe diffusion and the lattice diffusion are predominant at high stresses and low stresses, respectively.
引用
收藏
页码:1398 / 1402
页数:5
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