Understanding CMP-induced delamination in ultra low-k/Cu integration

被引：26

作者：

Leduc, P ^{[1
]}

Savoye, M ^{[1
]}

Maitrejean, S ^{[1
]}

Scevola, D ^{[1
]}

Jousseaume, V ^{[1
]}

Passemard, G ^{[1
]}

机构：

[1] CEA, DRT, LETI, F-38054 Grenoble, France

来源：

PROCEEDINGS OF THE IEEE 2005 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE | 2005年

关键词：

ADHESION; FILMS;

D O I：

10.1109/IITC.2005.1499984

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In-situ friction characterization during chemical-mechanical polishing (CMP) was investigated to understand delamination mechanisms of porous ultra low-k (ULK)/Cu stack. By quantifying the delaminated area within wafer, it was shown that adhesion failure is driven by the work done against the CMP-induced friction force, and is correlated to the adhesion strength of the weakest interface. A low-stress CMP was successfully achieved on a first level of ULK/Cu interconnects having a low adhesion SiC/ULK interface (Gc=1.3 J/m(2)) and a porous dielectric material with low mechanical properties (Young's modulus E=3.5 Gpa, Hardness H=0.7 Gpa).

引用

页码：209 / 211

页数：3

共 5 条

[1] Description of the porosity of inhomogeneous porous low-k films using solvent adsorption studied by spectroscopic ellipsometry in the visible range
Bourgeois, A
Bruneau, AB
Jousseaume, V
Rochat, N
Fisson, S
Demarets, B
Rivory, J
[J]. THIN SOLID FILMS, 2004, 455 : 366 - 369
[2] Low-pressure CMP for reliable porous low-k/Cu integration
Kondo, S
Tokitoh, S
Yoon, BU
Namiki, A
Sone, A
Ohashi, N
Misawa, K
Sone, S
Shin, HJ
Yoshie, T
Yoneda, K
Shimada, M
Ogawa, S
Matsumoto, I
Kobayashi, N
[J]. PROCEEDINGS OF THE IEEE 2003 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2003, : 86 - 88
[3] LEDUC P, 2004, P VMIC 2004, P120
[4] Adhesion studies of thin films on Ultra Low K
Maîtrejean, S
Fusalba, F
Patz, M
Jousseaume, V
Mourier, T
[J]. PROCEEDINGS OF THE IEEE 2002 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2002, : 206 - 208
[5] Interfacial adhesion of copper-low k interconnects
Scherban, T
Sun, B
Blaine, J
Block, C
Jin, B
Andideh, E
[J]. PROCEEDINGS OF THE IEEE 2001 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2001, : 257 - 259

← 1 →