Understanding CMP-induced delamination in ultra low-k/Cu integration

被引：26

作者：

Leduc, P ^{[1
]}

Savoye, M ^{[1
]}

Maitrejean, S ^{[1
]}

Scevola, D ^{[1
]}

Jousseaume, V ^{[1
]}

Passemard, G ^{[1
]}

机构：

[1] CEA, DRT, LETI, F-38054 Grenoble, France

来源：

PROCEEDINGS OF THE IEEE 2005 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE | 2005年

关键词：

ADHESION; FILMS;

D O I：

10.1109/IITC.2005.1499984

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In-situ friction characterization during chemical-mechanical polishing (CMP) was investigated to understand delamination mechanisms of porous ultra low-k (ULK)/Cu stack. By quantifying the delaminated area within wafer, it was shown that adhesion failure is driven by the work done against the CMP-induced friction force, and is correlated to the adhesion strength of the weakest interface. A low-stress CMP was successfully achieved on a first level of ULK/Cu interconnects having a low adhesion SiC/ULK interface (Gc=1.3 J/m(2)) and a porous dielectric material with low mechanical properties (Young's modulus E=3.5 Gpa, Hardness H=0.7 Gpa).

引用

页码：209 / 211

页数：3

共 5 条

[1] Description of the porosity of inhomogeneous porous low-k films using solvent adsorption studied by spectroscopic ellipsometry in the visible range [J].

Bourgeois, A ;

Bruneau, AB ;

Jousseaume, V ;

Rochat, N ;

Fisson, S ;

Demarets, B ;

Rivory, J .

THIN SOLID FILMS, 2004, 455 :366-369

[2] Low-pressure CMP for reliable porous low-k/Cu integration [J].

Kondo, S ;

Tokitoh, S ;

Yoon, BU ;

Namiki, A ;

Sone, A ;

Ohashi, N ;

Misawa, K ;

Sone, S ;

Shin, HJ ;

Yoshie, T ;

Yoneda, K ;

Shimada, M ;

Ogawa, S ;

Matsumoto, I ;

Kobayashi, N .

PROCEEDINGS OF THE IEEE 2003 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2003, :86-88

[3]

LEDUC P, 2004, P VMIC 2004, P120

[4] Adhesion studies of thin films on Ultra Low K [J].

Maîtrejean, S ;

Fusalba, F ;

Patz, M ;

Jousseaume, V ;

Mourier, T .

PROCEEDINGS OF THE IEEE 2002 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2002, :206-208

[5] Interfacial adhesion of copper-low k interconnects [J].

Scherban, T ;

Sun, B ;

Blaine, J ;

Block, C ;

Jin, B ;

Andideh, E .

PROCEEDINGS OF THE IEEE 2001 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2001, :257-259

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