3D hierarchical CuS microflowers constructed on copper powders-filled nickel foam as advanced binder-free electrodes

被引:25
作者
Ying, Zongrong [1 ]
Zhao, Shuangsheng [1 ]
Yue, Jinru [1 ]
Ju, Tao [1 ]
Zhang, Yongzheng [1 ]
Xie, Jie [1 ]
Wang, Qi [1 ]
机构
[1] Nanjing Univ Sci & Technol, Sch Chem Engn, Dept Mat Sci & Engn, Nanjing 210094, Peoples R China
关键词
Nickel foam; Copper powder; Filling; CuS; Microflower; Supercapacitor; STABLE BIFUNCTIONAL ELECTROCATALYSTS; NI-FOAM; SULFIDE NANOSHEETS; OXYGEN EVOLUTION; HIGHLY EFFICIENT; NANOWIRE ARRAYS; LOW-TEMPERATURE; ENERGY DENSITY; TEMPLATE-FREE; PERFORMANCE;
D O I
10.1016/j.jallcom.2019.153437
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
A novel strategy, consisting of sonication-assisted filling step followed by a chemical-bath surface sulfidization process, was designed to fabricate 3D hierarchical CuS microflowers constructed on copper powders-filled nickel foam (Cu@CuS-NF) as advanced binder-free electrodes for high-performance supercapacitors. Scanning electron microscope, powder X-ray diffraction and X-ray photoelectron spectroscopy techniques were employed to confirm the microstructure and composition. Electrochemical measurements demonstrated that the Cu@CuS-NF electrode has highly improved capacitance with an ultra-high area capacitance of 11.4 F cm(-2) at a high current density of 90 mA cm(-2). Also, the Cu@CuS-NF electrode has superior cycling stability with more than 100% retention of the initial area capacitance after 3000 cycles at 180 mA cm(-2). The excellent electrochemical performance can be mostly attributed to a combination of the ultra-large loading area and very good electroconductive network formed from copper powders filling inside nickel foam. Our work opens a new door to engineering ultra-high-performance nickel-foam-based electrodes for electrochemical devices including water splitting and energy storage/conversion. (C) 2019 Elsevier B.V. All rights reserved.
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页数:7
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