A mesoscopic characterization of creep in thin metal films

被引：0

作者：

Zheng, Y. X. ^{[1
]}

Niu, L. S. ^{[1
]}

Shi, H. J. ^{[1
]}

机构：

[1] Tsinghua Univ, Failure Mech Lab, Dept Engn Mech, Sch Aerosp, Beijing 100084, Peoples R China

来源：

ADVANCES IN HETEROGENEOUS MATERIAL MECHANICS 2008 | 2008年

关键词：

thin films; diffusion; dislocation; creep;

D O I：

暂无

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

A mesoscopic characterization of mechanical behavior of thin metal films is developed. A functional of energy rate is set up. Introducing diffusion boundary conditions coupled with elastic and plastic process, an equation which can be solved by finite element method is derived from variation of the function. The method is illustrated with examples of creep in thin metal films with different parameters. Results show that the significance of different mechanisms varies with the parameters. The method is available for qualitative or semi-quantitative analysis of thin metal films in mesoscopic scale.

引用

页码：1581 / 1584

页数：4

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