Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology-Sensing Head Interfacing

被引：16

作者：

Chen, Shiying ^{[1
]}

Vilchis-Rodriguez, Damian ^{[1
]}

Djurovic, Sinisa ^{[1
]}

Barnes, Mike ^{[1
]}

Mckeever, Paul ^{[2
]}

Jia, Chunjiang ^{[2
]}

机构：

[1] Univ Manchester, Dept Elect & Elect Engn, Manchester M13 9PL, Lancs, England

[2] Offshore Renewable Energy ORE Catapult, Newcastle Upon Tyne NE24 1LZ, Tyne & Wear, England

来源：

IEEE SENSORS JOURNAL | 2022年 / 22卷 / 02期

关键词：

Insulated gate bipolar transistors; Temperature sensors; Temperature measurement; Fiber gratings; Optical fiber sensors; Junctions; Load modeling; FBG; IGBT; thermal sensing; in-situ sensing; optical-fiber; MODEL; CONVERTERS; FAILURE; SENSOR;

D O I：

10.1109/JSEN.2021.3131322

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper assesses the suitability of the use of Fiber Bragg Grating Sensors for effective in-situ sensing of the IGBT junction temperature. To this end, the optical sensor is installed on the chip surface in a commercial IGBT module, enabling direct reading of its junction temperature. Two sensor interfacing configurations are evaluated by means of Finite Element simulations and experiments on a purpose designed laboratory test system. Experiments show the feasibility on the use of FBG sensing technology for reliable and effective real-time measurement of the junction temperature in a wide operating envelope of the tested IGBT device.

引用

页码：1309 / 1320

页数：12

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