Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology-Sensing Head Interfacing

被引：16

作者：

Chen, Shiying ^{[1
]}

Vilchis-Rodriguez, Damian ^{[1
]}

Djurovic, Sinisa ^{[1
]}

Barnes, Mike ^{[1
]}

Mckeever, Paul ^{[2
]}

Jia, Chunjiang ^{[2
]}

机构：

[1] Univ Manchester, Dept Elect & Elect Engn, Manchester M13 9PL, Lancs, England

[2] Offshore Renewable Energy ORE Catapult, Newcastle Upon Tyne NE24 1LZ, Tyne & Wear, England

来源：

IEEE SENSORS JOURNAL | 2022年 / 22卷 / 02期

关键词：

Insulated gate bipolar transistors; Temperature sensors; Temperature measurement; Fiber gratings; Optical fiber sensors; Junctions; Load modeling; FBG; IGBT; thermal sensing; in-situ sensing; optical-fiber; MODEL; CONVERTERS; FAILURE; SENSOR;

D O I：

10.1109/JSEN.2021.3131322

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper assesses the suitability of the use of Fiber Bragg Grating Sensors for effective in-situ sensing of the IGBT junction temperature. To this end, the optical sensor is installed on the chip surface in a commercial IGBT module, enabling direct reading of its junction temperature. Two sensor interfacing configurations are evaluated by means of Finite Element simulations and experiments on a purpose designed laboratory test system. Experiments show the feasibility on the use of FBG sensing technology for reliable and effective real-time measurement of the junction temperature in a wide operating envelope of the tested IGBT device.

引用

页码：1309 / 1320

页数：12

共 37 条

[1] A Review on IGBT Module Failure Modes and Lifetime Testing [J].

Abuelnaga, Ahmed ;

Narimani, Mehdi ;

Bahman, Amir Sajjad .

IEEE ACCESS, 2021, 9 :9643-9663

[2] An Extended Multilayer Thermal Model for Multichip IGBT Modules Considering Thermal Aging [J].

Akbari, Mohsen ;

Bina, Mohammad Tavakoli ;

Bahman, Amir Sajjad ;

Eskandari, Bahman ;

Pouresmaeil, Edris ;

Blaabjerg, Frede .

IEEE ACCESS, 2021, 9 :84217-84230

[3] A Failure-Detection Strategy for IGBT Based on Gate-Voltage Behavior Applied to a Motor Drive System [J].

Antonio Rodriguez-Blanco, Marco ;

Claudio-Sanchez, Abraham ;

Theilliol, Didier ;

Gerardo Vela-Valdes, Luis ;

Sibaja-Teran, Pedro ;

Hernandez-Gonzalez, Leobardo ;

Aguayo-Alquicira, Jesus .

IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2011, 58 (05) :1625-1633

[4] A Lumped Thermal Model Including Thermal Coupling and Thermal Boundary Conditions for High-Power IGBT Modules [J].

Bahman, Amir Sajjad ;

Ma, Ke ;

Blaabjerg, Frede .

IEEE TRANSACTIONS ON POWER ELECTRONICS, 2018, 33 (03) :2518-2530

[5] A 3-D-Lumped Thermal Network Model for Long-Term Load Profiles Analysis in High-Power IGBT Modules [J].

Bahman, Amir Sajjad ;

Ma, Ke ;

Ghimire, Pramod ;

Iannuzzo, Francesco ;

Blaabjerg, Frede .

IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2016, 4 (03) :1050-1063

[6] Thermal characteristics analysis of an IGBT using a fiber Bragg grating [J].

Bazzo, Joao Paulo ;

Lukasievicz, Tiago ;

Vogt, Marcio ;

de Oliveira, Valmir ;

Kalinowski, Hypolito Jose ;

Cardozo da Silva, Jean Carlos .

OPTICS AND LASERS IN ENGINEERING, 2012, 50 (02) :99-103

[7] Review of power semiconductor device reliability for power converters [J].

Wang, Bo ;

Cai, Jie ;

Du, Xiong ;

Zhou, Luowei .

CPSS Transactions on Power Electronics and Applications, 2017, 2 (02) :101-117

[8] An ON-State Voltage Calculation Scheme of MMC Submodule IGBT [J].

Chen, Shiying ;

Ji, Shengchang ;

Pan, Liang ;

Liu, Chenshuo ;

Zhu, Lingyu .

IEEE TRANSACTIONS ON POWER ELECTRONICS, 2019, 34 (08) :7996-8007

[9] Sensitivity enhanced strain and temperature measurements based on FBG and frequency chirp magnification [J].

Du, Jiangbing ;

He, Zuyuan .

OPTICS EXPRESS, 2013, 21 (22) :27111-27118

[10]

Dupont L, 2012, APPL POWER ELECT CO, P182, DOI 10.1109/APEC.2012.6165817

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