Power and Signal Integrity Analysis of High-speed Mixed-signal Backplane Based on VPX

被引：0
|
作者：
Meng Hua [1 ]
Niu Minxi [1 ]
Tan Anju [1 ]
Miao Jianghong [1 ]
机构：
[1] China Acad Engn Phys, Inst Elect Engn, Mianyang 621900, Sichuan, Peoples R China
来源：
2018 IEEE SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL INTEGRITY AND POWER INTEGRITY (EMC, SI & PI) | 2018年
关键词：
Power Integrity; simultaneous Switching Noise (SSN); Electromagnetic Band gap (EBG); Signal Integrity; SIMULTANEOUS SWITCHING NOISE; BAND SUPPRESSION; EMI REDUCTION; PLANE; MITIGATION;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, the problem of simultaneous switching noise (SSN) in the design of high-speed mixed-signal backplane is analyzed from the aspect of power integrity. How to suppress SSN of high-speed mixed-signal backplane becomes an important research direction at present. Based on the analysis of the traditional decoupling capacitor noise reduction method and the latest noise reduction principle of the electromagnetic band gap (EBG) structures, a novel type of EBG structures is proposed to suppress the noise on the printed circuit board (PCB). The simulation and measurement results show that the noise isolation depth reaches -40dB in the frequency band from 0.4 to 20GHz, which achieves the effect of ultra-wideband high isolation and meets the power and signal integrity requirements of high-speed mixed-signal backplane based on VPX(VITA 46). It provides an experimental reference for the application of the EBG structure on other high-speed mixed-signal backplane and other projects.
引用
收藏
页码：577 / 581
页数：5
相关论文
共 50 条
  • [31] Signal Integrity Analysis of High-Speed Board-to-Board Floating Connectors for Automotive Systems
    Park, Shinyoung
    Kim, Hyesoo
    Kim, Jonghoon
    Kim, Joungho
    Kim, Unho
    Park, Jungmin
    Jeon, Yuckhwan
    2017 IEEE 26TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS), 2017,
  • [32] Enhancing High Speed Signal Integrity with Optimized Board Level Power Network Design
    Fei, Yee Chang
    Jambek, Asral Bahari
    Al-Hadi, Azremi Abdullah
    ADVANCED SCIENCE LETTERS, 2017, 23 (06) : 5019 - 5023
  • [33] Air Isolated High-Speed PCB Connector's Signal Integrity Design
    Kuang Shenqing
    Hu Le
    Zhao Mingmin
    Dai Hepeng
    ISAPE 2008: THE 8TH INTERNATIONAL SYMPOSIUM ON ANTENNAS, PROPAGATION AND EM THEORY, PROCEEDINGS, VOLS 1-3, 2008, : 1058 - +
  • [34] Using Evolutionary Algorithms for Signal Integrity Assessment of High-Speed Data Buses
    Maynard Falconer
    Garrison Greenwood
    Kristina Morgan
    KiranKumar Kamisetty
    Adam Norman
    Konika Ganguly
    Journal of Electronic Testing, 2010, 26 : 297 - 305
  • [35] Signal Integrity Issues due to ESD events in High-Speed CMOS Comparator
    Nicuta, Ana-Maria
    Bicleanu, Paul
    Salceanu, Alexandru
    2013 8TH INTERNATIONAL SYMPOSIUM ON ADVANCED TOPICS IN ELECTRICAL ENGINEERING (ATEE), 2013,
  • [36] Analysis of Signal Integrity on High Speed Signal Processing System of Vehicle-Mounted Video
    Wang, X.
    Tang, J. S.
    PROCEEDINGS OF THE INTERNATIONAL CONFERENCE ON COMPUTER INFORMATION SYSTEMS AND INDUSTRIAL APPLICATIONS (CISIA 2015), 2015, 18 : 450 - 452
  • [37] Using Evolutionary Algorithms for Signal Integrity Assessment of High-Speed Data Buses
    Falconer, Maynard
    Greenwood, Garrison
    Morgan, Kristina
    Kamisetty, KiranKumar
    Norman, Adam
    Ganguly, Konika
    JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2010, 26 (03): : 297 - 305
  • [38] Signal Integrity Analysis of High Speed Channel considering Thermal Distribution
    Son, Keeyoung
    Kim, Seongguk
    Kim, Minsu
    Lho, Daehwan
    Kim, Keunwoo
    Park, Hyunwook
    Park, Gapyeol
    Kim, Joungho
    IEEE 30TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2021), 2021,
  • [39] Optimization analysis of high-speed differential signal vias in package
    Luo, Jiahu
    Yang, Huan
    Qin, Wenjuan
    Ma, XiaoJian
    Liu, Weidong
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [40] Signal Integrity Analysis of High-speed PCIe Channel with Board-to-Board Interconnect for High-Performance Server
    Kim, Seongguk
    Son, Keeyoung
    Yoon, Jiwon
    Shin, Taein
    Kim, Keunwoo
    Sim, Boogyo
    Park, Joonsang
    Cho, Seonguk
    Kim, Jihun
    Kim, Haeyeon
    Kim, Joungho
    Park, Hyunwook
    IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS, EDAPS 2023, 2023,
12345