Bonding mechanism in ultrasonic-assisted soldering of ZrO2 and 304 stainless steel using a micro-alloyed active solder alloy

被引：2
作者：
Liu, Yan [1 ]
Cui, Wei [2 ]
Ji, Xiulin [1 ,3 ]
机构：
[1] Hohai Univ, Coll Mech & Elect Engn, Changzhou 213022, Peoples R China
[2] Changzhou Vocat Inst Mechatron Technol, Inst Mold Technol, Changzhou 213164, Peoples R China
[3] Shantou Univ, Coll Engn, Shantou 515063, Peoples R China
来源：
MATERIALS LETTERS | 2022年 / 322卷
基金：
中国国家自然科学基金;
关键词：
Ultrasonic active soldering; Microalloying; Ceramics; Microstructure;
D O I：
10.1016/j.matlet.2022.132456
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Ceramic-metal soldering joints are widely needed in various industries and a key factor in soldering is the interfacial bonding between the ceramic and solder alloys. Active elements, such as Ti and rare earth, are often added to solder alloys to realize interfacial bonding. The content of the active elements is usually 2 ~ 4 wt%, which can significantly increase the melting temperature of the solder alloys. In this research, a micro-alloyed reactive solder comprising Sn-3.0Ag-0.5Cu alloy with 0.2 wt% Ti was used to solder ZrO2 ceramics and 304 stainless steel. The effective interfacial reaction was achieved with the aid of the ultrasound. The reaction product was Zr0.5Ti0.35Sn0.15O2 and Ti11.3Sn3O10 at the Sn-Ag-Cu-Ti/ZrO2 interface, and the maximum shear strength of the soldered specimens was 30.75 +/- 9.92 Mpa. The melting temperature of the soldering alloy was not significantly increased compared to regular Sn-Ag-Cu solder alloy.
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页数：4
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